Connector Spring Mechanism for Collarless PCB Contact
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional pressure spring devices cannot be used in control devices without a collar on the housing of the printed circuit board, leading to unreliable contact between the connector and the printed circuit board, and the assembly process is costly and complex.
Innovation Solution
A connector design with a pressure spring device integrated directly onto the contact carrier, which converts the plugging force into an orthogonal force to ensure reliable contact between the contact elements and the printed circuit board, suitable for collarless control devices, and allows for easier assembly by shifting the pressure spring device from an assembly position to a latching position.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional pressure spring device arranged on a collar is used, then reliable contact can be ensured in control devices with a collar, but it cannot be used in control devices without a collar and increases assembly complexity
Solution Approach 1:
The pressure spring device is merged with the contact carrier to form an integrated assembly. The contact carrier is designed with an integrated body that incorporates the pressure spring mechanism, eliminating the need for separate collar-based spring devices and reducing the number of components. This merging allows the same contact mechanism to work in both collarless and collared control devices.
Solution Approach 2:
The contact carrier is designed as a universal component that can function in multiple configurations. It can be used in control devices with or without a collar, and can accommodate different types of printed circuit boards. The integrated pressure spring device within the contact carrier provides universal applicability across different control device designs, eliminating the need for variant designs based on collar presence.
2Ease of manufacture
If the pressure spring device is integrated directly on the contact carrier, then assembly is simplified and collarless devices are supported, but the force transmission must be optimized
Solution Approach 1:
The force transmission is optimized by changing the dimensional orientation of the force application. The pressure spring device applies force in a direction perpendicular to the main insertion axis, utilizing a lateral force transmission area on the contact carrier. This dimensional change allows efficient force transmission without requiring precise alignment along the insertion path, simplifying both manufacturing and assembly while maintaining contact reliability.
3Device complexity
If the contact carrier is designed as a single piece, then assembly is simplified, but the force transmission area must be larger to compensate for the integrated design
Solution Approach 1:
The single-piece contact carrier design compensates for the integrated structure by utilizing a laterally extended force transmission area. Instead of requiring a larger area in the direction of insertion, the design extends the force transmission surface perpendicular to the insertion axis, allowing the pressure spring device to apply force efficiently across a distributed area that maintains contact pressure while simplifying the overall carrier structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Ensures reliable electrical contact in various control device configurations, reduces assembly costs and complexity by allowing the pressure spring device to be moved into a latching position after contact element installation, and eliminates the need for additional spacer elements.
Implementation Method 1
The pressure spring device is designed to be shifted from an assembly position into a latching position. The pressure spring device is designed to change its position in relation to the contact carrier during displacement and to retain its shape.
Implementation Method 2
a pressure spring device (9). The pressure spring device (9) is designed to press the contact elements (7) against the contact surfaces (32) of the printed circuit board (3)
Data Source
Figure 1
Figure 2~3C
Figure 4A~4D
AI summary
The plug (1) has contact elements (7) arranged in contact carriers (5) for retaining a circuit board. Pressing spring devices (9) press the contact elements on contact surfaces of the board. The spring devices have power transmission regions (17) arranged vertical to a plug direction (11). The spring devices are arranged at the plug such that the spring devices convert force acting on the power transmission regions in the direction into contact normal force acting on the contact elements vertical to the direction. The spring devices provide spacer function. An independent claim is also included for a plug connection.