Implantable Connector Stack With Encapsulation Layer
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Solution Overview
Problem
Existing connector assemblies for implantable medical devices face manufacturing challenges due to complex dimensions and assembly requirements, making them difficult, costly, and time-consuming to produce, while also needing to be adaptable and easier to manufacture.
Innovation Solution
A free-standing axially compressed connector stack comprising conducting ring elements, seal elements, and canted coil springs, encapsulated with a dielectric material, such as a thermoset or thermoplastic polymer, which maintains axial compression and simplifies the manufacturing process by allowing easier integration into implantable medical devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional connector assemblies are used, then reliable electrical contact is achieved, but manufacturing complexity and cost increase
Solution Approach 1:
The connector assembly is divided into discrete modular components including conductive rings, insulative elements, and seal elements that can be independently manufactured and then stacked together. This segmentation allows each component to be optimized separately while simplifying the overall manufacturing process through standardized assembly procedures.
Solution Approach 2:
Multiple functional elements (conductive contacts, insulation, and sealing) are combined into a single integrated stack assembly that functions as one unit. The stacked configuration merges these previously separate components into a compact structure that maintains reliable electrical contact while reducing manufacturing steps.
2Reliability
If traditional connector assemblies are used, then electrical transmission functionality is achieved, but manufacturing time and cost increase
Solution Approach 1:
The conductive rings, insulative elements, and seal elements are pre-formed as standardized components with predetermined dimensions and properties. This preliminary preparation allows for rapid assembly through simple stacking operations, significantly reducing manufacturing time while ensuring consistent electrical transmission functionality.
Solution Approach 2:
The invention employs standardized dimensional parameters and material properties for the stacked components that optimize both electrical performance and manufacturing efficiency. By establishing fixed parameters for ring thickness, insulator dimensions, and seal element specifications, the design enables scalable production while maintaining functional reliability.
3Adaptability or versatility
If multi-circuit receptacles are manufactured with existing methods, then multiple contact circuits are achieved, but assembly difficulty and cost increase
Solution Approach 1:
Each contact circuit is implemented as a separate conductive ring within the stack, allowing multiple circuits to be independently configured and assembled. This segmentation enables flexible multi-circuit designs where each ring can be optimized for its specific electrical pathway while maintaining simple overall assembly procedures.
Solution Approach 2:
The standardized stack design with alternating conductive and insulative elements creates a universal building block that can be replicated and combined to create multi-circuit receptacles. This universal configuration allows the same basic stack structure to serve multiple circuit functions, simplifying manufacturing while achieving versatile electrical connectivity.
Data Source
AI summary
Connector assemblies for use with implantable medical devices having easy to assemble contacts are disclosed. The connector assemblies are generally formed by coupling a plurality of ring contacts, sealing rings, and spring contact elements together with at least one holding ring to form a connector having a common bore for receiving a medical lead cable. Contact grooves or spring chambers for positioning the spring contact elements are formed in part by assembling multiple components together. A further aspect is a provision for encasing each connector assembly or stack inside a thermoset layer or a thermoplastic layer before over-molding the same to a sealed housing.