Connector Assembly for Stacked Semiconductor Die Thermal Management

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Solution Overview

Problem

The semiconductor industry faces challenges in forming effective electrical interconnects and thermal dissipation in stacked semiconductor die structures, which complicates the manufacturing process and increases costs.

Innovation Solution

A connector assembly with opposing surfaces and ends, featuring an electrically insulating material layer on one or both surfaces, allowing for efficient electrical signal transmission and thermal dissipation, is developed. The assembly includes a copper or similar metal electrical connector with an insulating layer, enabling the stacking of semiconductor die while reducing the footprint on printed circuit boards and facilitating heat removal.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If semiconductor die are vertically stacked to reduce footprint, then area of printed circuit board is reduced, but forming electrical interconnects and removing heat becomes more difficult

Engineering Contradiction:

Improvefootprint on printed circuit boardVSAvoidcomplexity of forming electrical interconnects and thermal dissipation

Core Design Contradiction:

Area of stationary objectVSDevice complexity

Solution Approach 1:

The patent combines electrical interconnection and thermal dissipation functions into a single integrated connector assembly. The electrically conductive connector simultaneously serves as an electrical interconnect between stacked semiconductor die and as a heat dissipation pathway, eliminating the need for separate electrical and thermal management structures.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The connector assembly performs multiple functions: it provides electrical connection between die, dissipates heat from the stacked structure, and provides structural support for stacking. This multi-functional design reduces overall device complexity by consolidating what would otherwise require separate components.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Reliability

If wire bonding is used to form electrical interconnections in stacked die, then electrical connectivity is achieved, but manufacturing time and cost increase

Engineering Contradiction:

Improveelectrical interconnection reliabilityVSAvoidmanufacturing time

Core Design Contradiction:

ReliabilityVSLoss of time

Solution Approach 1:

The connector assembly is pre-formed with electrical connection paths before the stacking process. This eliminates the need for time-consuming wire bonding operations after stacking, as the electrical interconnections are already established in the connector structure prior to assembling the semiconductor die.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent replaces the mechanical wire bonding process with a pre-formed electrical connection system integrated into the connector. This substitution eliminates the manual or automated wire bonding step, significantly reducing manufacturing time while maintaining reliable electrical connections.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Productivity

If stacked die structure is used to increase functionality, then number of semiconductor components is increased, but thermal dissipation becomes more difficult

Engineering Contradiction:

Improvefunctionality per unit areaVSAvoidheat removal efficiency

Core Design Contradiction:

ProductivityVSTemperature

Solution Approach 1:

The electrically conductive connector acts as an intermediary thermal pathway between the stacked semiconductor die and the heat sink or cooling structure. It efficiently conducts heat away from the die while maintaining electrical connection, solving the thermal management challenge inherent in high-density stacked configurations.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The connector assembly enables efficient electrical signal transmission and thermal dissipation, reducing manufacturing complexity and costs by allowing for the stacking of semiconductor die with improved heat management.

Implementation Method 1

An electrically insulating material is formed on one surface in one of the ends of the electrical connector

Methodology Applied

Scientific EffectElectrical insulation: Electrical Resistance

Implementation Method 2

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS8449339B2Connector assembly and method of manufacture

Publication Date: 2013.05.28 SEMICON COMPONENTS IND LLC

AI summary

A connector assembly and a method for manufacturing the connector assembly. In accordance with embodiments, the connector assembly includes an electrical connector having first and second surfaces and first and second ends. A layer of electrically insulating material is formed from or on a portion of the first surface at the first end. Optionally, a layer of electrically insulating material can be formed from or on the second surface.