Connector Stress Control Device for High Voltage Reliability
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Solution Overview
Problem
Current connectors for high voltage applications face issues with localized electrical stress concentrations at the ends of conductive layers, leading to potential partial discharge and failure at unacceptably low voltages, necessitating large, heavy, and expensive components to mitigate stress points.
Innovation Solution
A connector unit with a stress control device comprising a conductive component, insulative moulding, and fastening structure, which is mounted in a bore of the female part and features a tapered contour to distribute electrical stress homogeneously, reducing stress concentrations and preventing detrimental effects on insulating oils.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If components of sufficiently large size are used to avoid high stress points, then reliability is improved, but weight and cost increase
Solution Approach 1:
The patent applies local quality by introducing a stress control device with specific local properties (conductive material with controlled resistivity) at the critical end region of the conductive layer. This localized intervention allows the connector to maintain reliability without requiring overall enlargement of components, thus avoiding increased weight while solving the stress concentration problem at specific locations.
Solution Approach 2:
The patent changes the electrical parameter (resistivity) of the stress control device to optimize stress distribution. By selecting a conductive material with controlled resistivity between 10^-6 and 10^-3 ohm.m, the device modifies the electrical field distribution locally, reducing stress concentrations without requiring larger component dimensions, thereby maintaining low weight while improving reliability.
2Reliability
If components of sufficiently large size are used to avoid high stress points, then reliability is improved, but cost increases
Solution Approach 1:
The stress control device is a localized component with specific electrical properties applied only where needed (at the end region of the conductive layer). This localized approach reduces material costs compared to using large-sized components throughout, while maintaining reliability through targeted stress control at critical locations.
Solution Approach 2:
The stress control device uses composite material properties by combining conductive material with controlled resistivity characteristics. This allows optimization of electrical stress distribution without requiring expensive large-sized solid insulator components, achieving cost-effective reliability improvement through material property selection rather than size increase.
3Weight of stationary object
If electrically conductive plating is used to reduce connector size, then weight and cost are reduced, but localized stress concentrations occur
Solution Approach 1:
The stress control device acts as an intermediary element between the conductive layer and the surrounding insulating medium. It mediates the electrical field distribution by providing a controlled transition zone with specific resistivity, preventing abrupt field termination that causes stress concentrations. This allows the use of thin conductive plating (reducing weight) while maintaining reliability through the intermediary stress control device.
Solution Approach 2:
The patent changes the electrical parameter (resistivity) by introducing the stress control device with controlled resistivity values. This parameter change creates a gradual electrical field transition instead of abrupt termination, eliminating stress concentrations that would otherwise require thicker plating or larger components. The weight reduction is achieved while maintaining reliability through this parameter optimization.
4Weight of stationary object
If electrically conductive plating is used to reduce connector size, then weight and cost are reduced, but stress concentrations lead to partial discharge
Solution Approach 1:
The stress control device serves as an intermediary that prevents direct interaction between the conductive plating end and the insulating medium. By introducing this intermediate layer with controlled resistivity, it prevents abrupt field termination that would cause partial discharge. This allows use of lightweight conductive plating while eliminating the harmful partial discharge effect through the intermediary device.
Solution Approach 2:
The patent converts the potentially harmful effect of abrupt field termination into a beneficial gradual field distribution. By using the stress control device with controlled resistivity, the abrupt edge effect (harmful) is transformed into a controlled electrical field gradient (beneficial), eliminating partial discharge risk while maintaining the weight advantages of thin conductive plating.
Data Source
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AI summary
The present invention relates to a connector part (10) of a connector unit (12) with a male part (14) and a female part (16), comprising at least one electrically conductive layer (18, 20) comprising at least one end region (22, 24) being electrically stressed after a mating process of the male part (14) and the female part (16). To minimize electrical stress concentrations the connector part (10) is characterised by at least one stress control device (26, 26a; 28, 28a) for reducing electrical stress at the at least one end region (22, 24).