Through-Hole Connector Substrate for Impedance Matching
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Solution Overview
Problem
Conventional connectors have low impedance and form low impedance points due to open stubs, which adversely affect signal transmission quality in high-speed and high-frequency applications.
Innovation Solution
The connector design includes through holes between signal and grounding terminals on a substrate, reducing the environmental equivalent dielectric constant and improving characteristic impedance to prevent low impedance points.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the connector uses conventional design with open stub and long contact area, then the structure is simple and easy to manufacture, but the impedance is low and forms low impedance points that degrade signal transmission quality
Solution Approach 1:
The substrate is segmented by introducing through holes that divide the dielectric material into separate regions. This segmentation reduces the equivalent dielectric constant in the signal transmission path, thereby increasing characteristic impedance and eliminating low impedance points without requiring complex terminal structures
Solution Approach 2:
The invention changes the physical parameters of the substrate by creating through holes with specific dimensions and positions. This modifies the equivalent dielectric constant of the substrate material, which directly affects the characteristic impedance of the contact areas and resolves the impedance mismatch problem
2Reliability
If the connector increases characteristic impedance to prevent low impedance points, then signal transmission quality improves, but the substrate structure becomes more complex
Solution Approach 1:
The through holes segment the substrate dielectric into discrete regions, which is a straightforward fabrication approach using standard PCB drilling and plating processes. This segmentation method achieves impedance control without requiring complex multi-layer structures or specialized manufacturing techniques
Solution Approach 2:
The through holes are strategically positioned in specific local areas of the substrate where impedance control is needed. This local modification approach allows the rest of the substrate to maintain its simple structure, balancing manufacturing ease with signal transmission quality in the critical contact regions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances signal transmission quality by increasing characteristic impedance and reducing reflection loss, benefiting high-speed and high-frequency connections.
Implementation Method 1
the substrate of the connector may have the through holes disposed between the contact area of the first signal terminal and the contact area of the second signal terminal, and may have the through holes disposed between the contact area of the first signal terminal and the contact area of the first grounding terminal, so as to effectively reduce the environmental equivalent dielectric constant
Data Source
AI summary
A connector includes a first grounding terminal, a first signal terminal, a second signal terminal, a second grounding terminal, and a substrate. The first grounding terminal, the first signal terminal, the second signal terminal, and the second grounding terminal are arranged in sequence, and each of them has a contact area. The first grounding terminal, the first signal terminal, the second signal terminal, and the second grounding terminal are sequentially disposed on the substrate and are parallel to each other. The substrate has plural through holes disposed between the first signal terminal and the second signal terminal.