Connector Terminal Assembly with Pre-Electroplated Contact Layer

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Solution Overview

Problem

Existing connector terminals require direct electroplating, which reduces manufacturing efficiency and increases costs due to the need for separate electroplating of each terminal.

Innovation Solution

A connector terminal design featuring a terminal body and an electroplated component with a substrate layer and an electroplating layer, where the substrate layer is attached to a local area of the terminal body and the electroplating layer is formed on the opposite surface for electrical contact.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If direct electroplating is performed on each connector terminal, then electrical contact performance is improved, but manufacturing efficiency decreases and costs increase

Engineering Contradiction:
Improveelectrical contact performanceVSAvoidmanufacturing efficiency
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The electroplated component is separated from the terminal body, allowing the electroplated substrate to be manufactured independently and then attached to the terminal body. This segmentation enables batch electroplating of substrates rather than individual electroplating of each terminal, thereby improving manufacturing efficiency while maintaining electrical contact performance.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The electroplating process is performed in advance on the substrate before the terminal is fully assembled. By pre-electroplating the substrate and then attaching it to the terminal body, the patent eliminates the need for final-stage electroplating on each completed terminal, thus improving productivity without compromising the electrical contact performance.

Inventive Principle:
Principle #10Preliminary action

2Reliability

If direct electroplating is performed on each connector terminal, then electrical contact performance is improved, but manufacturing costs increase

Engineering Contradiction:
Improveelectrical contact performanceVSAvoidmanufacturing cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

By dividing the connector terminal into a terminal body and a separate electroplated component, the patent enables independent manufacturing of each part. The electroplated substrate can be produced in batches using cost-effective electroplating processes, avoiding the high costs associated with individual electroplating of each assembled terminal.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The electroplating operation is performed in advance on the substrate during a separate manufacturing stage, allowing for more efficient batch processing and reduced material waste. This preliminary electroplating approach lowers the overall manufacturing cost compared to performing electroplating on each finished terminal.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design improves manufacturing efficiency and reduces costs by allowing for separate production and attachment of the electroplated component, while maintaining superior electrical contact performance.

Implementation Method 1

an electroplating layer which is formed on the second surface of the substrate layer for electrical contact with a mating terminal

Methodology Applied
Scientific EffectElectroplating: Electroplating

Data Source

PatentUS20250125549A1Connector terminal, connector, and method for manufacturing connector terminal
Publication Date: 2025.04.17 TYCO ELECTRONICS (SHANGHAI) CO LTD
  • US20250125549A1 patent drawing
  • US20250125549A1 patent drawing
  • US20250125549A1 patent drawing

AI summary

A connector terminal includes a terminal body and an electroplated component. The electroplated component includes a substrate layer and an electroplating layer. The substrate layer has a first and second surface opposite to each other in its thickness direction, wherein the first surface of the substrate layer is attached to a local area of the terminal body. The electroplating layer which formed on the second surface of the substrate layer for electrical contact with a mating terminal.