Electric Connector Terminal Bending After Electroplating
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Solution Overview
Problem
The manufacturing process of USB TYPE C electric connectors with high solder tails is inefficient due to increased volume and deformation issues, leading to reduced packaging efficiency and increased rejection rates during electroplating.
Innovation Solution
A method involving stamping a metal strip to form terminal sets with slender main arms, electroplating these sets, and then bending them into L-shaped contact and welding arms at a separate assembling station, rather than at the stamping station, to maintain a flat structure for improved packaging and electroplating quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If terminals are bent in the stamping die to achieve high solder tails, then the terminal structure conforms to requirements, but the volume of solder tails increases, reducing packaging efficiency
Solution Approach 1:
The patent applies preliminary action by stamping terminals with extended main arms in a flat state before electroplating, allowing for efficient packaging. The bending to create high solder tails is performed after electroplating at the assembling station, avoiding volume increase during packaging while achieving the required terminal structure later in the process.
2Length of stationary object
If solder tails are made relatively high to meet connector height requirements, then the electric connector height is increased, but the terminal is prone to deforming in the electroplating process, increasing rejection rate
Solution Approach 1:
The patent performs the bending action that creates high solder tails after electroplating rather than before. This timing ensures that the terminal maintains a flat, stable structure during electroplating, preventing deformation and reducing rejection rates, while still achieving the required height in the final product.
3Manufacturing precision
If terminals are bent in the stamping die, then the terminal structure conforms to requirements, but the number of terminals in a single package is reduced, affecting volume production
Solution Approach 1:
The patent stamps terminals with extended main arms in a flat configuration that allows compact packaging, maximizing the number of terminals per package. The bending to create high solder tails is performed as a preliminary action after electroplating, ensuring both high packaging density and correct terminal structure in the final product.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances packaging efficiency, reduces deformation during electroplating, and improves the overall quality of the electroplating process, addressing the inefficiencies and structural issues associated with high solder tails.
Implementation Method 1
electroplating the terminal set at the electroplating station
Data Source
AI summary
A method of manufacturing an electric connector includes: providing a metal strip and stamping on the metal strip at a stamping station to obtain a terminal set; packaging and conveying the terminal set to an electroplating station; electroplating and conveying the terminal set to an assembling station; bending and assembling the terminal set into the insulator. The bending operation of the terminal set is transferred to be carried out on the assembling station after the electroplating operation, and is prevented from being carried out at the stamping station. On the one hand, the structure of the terminal set can be kept flat after stamping, which can improve the packaging efficiency and the packaging quantity. On the other hand, the relatively flat structure of the terminal set is more conducive to electroplating treatment, which can improve the electroplating quality and prevent the terminal from deforming.