Electrical Connector Terminal Segmentation for Heat Reduction

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Solution Overview

Problem

The increasing current demand in smaller electronic devices leads to heat generation issues, potentially causing device failure due to elevated temperatures in existing electrical connectors.

Innovation Solution

The electrical connector design features terminals with two connecting portions, allowing for a dual-point connection to the substrate, reducing the electrical path length and overall resistance, thereby minimizing heat generation even under high current flow.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If a single connecting portion is used for terminal connection, then the device structure is simple, but the electrical resistance is high and heat generation occurs under high current flow

Engineering Contradiction:
Improveheat generationVSAvoidterminal structure
Core Design Contradiction:
Loss of energyVSDevice complexity

Solution Approach 1:

The terminal connecting portion is divided into multiple segments (first connecting portion and second connecting portion) that are electrically connected in parallel. This segmentation reduces the overall electrical resistance by providing multiple current paths, thereby reducing heat generation under high current flow conditions while maintaining a relatively simple overall structure.

Inventive Principle:
Principle #1Segmentation

2Power

If current demand is increased in smaller electronic devices, then the power capability is improved, but heat generation increases potentially causing device failure

Engineering Contradiction:
Improvecurrent capabilityVSAvoiddevice temperature
Core Design Contradiction:
PowerVSTemperature

Solution Approach 1:

The terminal structure is segmented into multiple connecting portions that conduct current in parallel. This allows the device to handle higher current demands by distributing the current across multiple paths, thereby increasing power capability while preventing excessive heat generation that would lead to device failure.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The terminal connecting portions are arranged in a spatial distribution rather than a single linear path. This dimensional arrangement creates multiple parallel current paths through the substrate, effectively increasing the cross-sectional area for current flow and reducing resistive heating while maintaining compact device dimensions.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design effectively suppresses heat generation and temperature increases, enhancing the reliability of electronic devices by reducing resistance and improving connection strength.

Implementation Method 1

The terminal is configured to be gripped by a terminal of the mating connector to be in contact with the mating connector terminal when mated with the mating connector

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 2

The increasing current demand in smaller electronic devices leads to heat generation issues, potentially causing device failure due to elevated temperatures in existing electrical connectors

Methodology Applied
Scientific EffectJoule heating: Joule Heating

Data Source

PatentUS11152727B2Electrical connector and electrical connector assembly
Publication Date: 2021.10.19 HIROSE ELECTRIC CO LTD
  • US11152727B2 patent drawing
  • US11152727B2 patent drawing
  • US11152727B2 patent drawing

AI summary

Provided is an electrical connector configured to be mounted on a substrate and including a terminal protruding in a direction mating with a mating connector. The terminal is configured to be gripped by a terminal of the mating connector to be in contact with the mating connector terminal when mated with the mating connector, and has a first connecting portion and a second connecting portion exposed on the substrate side.