Low-Profile Electrical Connector Terminal Structure for Solder Ball Stability

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Solution Overview

Problem

Existing electrical connectors with terminals that extend downward from soldering arms increase the height, hindering ultra-thin development and stability of the connector.

Innovation Solution

The electrical connector design includes terminals with a V-shaped bending section that abuts against solder balls, stabilized by a stopping block, reducing height and preventing upward movement, while utilizing a chamfer and oblique surfaces for precise assembly and reduced volume.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the terminal structure extends downward with hook portions to abut against solder balls, then the terminal can stably clamp the solder ball, but the height of the terminal structure increases

Engineering Contradiction:
Improveterminal stabilityVSAvoidterminal height
Core Design Contradiction:
ReliabilityVSLength of moving object

Solution Approach 1:

The patent changes the abutting direction from downward extension to upward abutment. The bending section of the terminal abuts against the solder ball from below, reversing the conventional downward hooking approach. This dimensional reversal reduces terminal height while maintaining stable clamping of the solder ball between the terminal and stopping wall.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Length of moving object

If the terminal structure is simplified to reduce height, then the connector achieves ultra-thin profile, but the terminal may become unstable and move upward

Engineering Contradiction:
Improveconnector heightVSAvoidterminal stability
Core Design Contradiction:
Length of moving objectVSStability of the object's composition

Solution Approach 1:

The patent introduces a stopping wall that extends upward from the insulating body to preemptively prevent upward movement of the terminal. This preliminary restraining structure counteracts any potential upward force on the terminal before it can detach, ensuring stability without requiring the terminal to extend downward.

Inventive Principle:
Principle #9Preliminary anti-action

3Reliability

If the bending section is positioned to abut against the solder ball, then the terminal achieves stable clamping, but the terminal structure becomes more complex

Engineering Contradiction:
Improvesolder ball clampingVSAvoidterminal structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines the solder ball clamping function and the upward movement prevention function into a single bending section structure. The bending section both abuts against the solder ball for clamping and works with the stopping wall to prevent terminal detachment, merging multiple functions into one integrated component that reduces overall structural complexity.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS12489230B2Electrical connector
Publication Date: 2025.12.02 LOTES
  • US12489230B2 patent drawing
  • US12489230B2 patent drawing
  • US12489230B2 patent drawing

AI summary

An electrical connector includes an insulating body, a plurality of terminals and a plurality of solder balls. Each terminal has a flat plate portion and two first soldering portions. A receiving slot is formed between the two first soldering portions. Two second soldering portions extend toward each other from lower ends of the two first soldering portions. Each of end portions of the two second soldering portion facing each other respectively bends toward a direction away from a corresponding solder ball to form a bending section. A plate surface of the bending section facing the corresponding solder ball is defined as a matching surface. Along a direction away from the corresponding solder ball, a gap between the two matching surfaces of each terminal becomes smaller. The corresponding solder ball is partially accommodated between the receiving slot and the two matching surfaces. The matching surface abuts against the corresponding solder ball.