Electrical Connector Terminal With Through-Slot for Signal Integrity

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Current electrical connectors experience self-inductance and crosstalk issues during high-frequency signal transmission due to densely arranged conductive pads and terminals, leading to poor high-frequency signal transmission capability.

Innovation Solution

The design incorporates a slot through the second arm of the terminal, which extends between the second and first arms, forming branches and a beam to reduce self-inductance and crosstalk, and includes a through-hole that does not run through the conducting portion to create multiple conductive paths for improved signal transmission.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If terminals are arranged densely to accommodate increasing conductive pads on chip modules, then the quantity of conductive pads is increased, but self-inductance effect and crosstalk are generated during high-frequency signal transmission

Engineering Contradiction:
Improvequantity of conductive padsVSAvoidhigh-frequency signal transmission capability
Core Design Contradiction:
Quantity of substanceVSReliability

Solution Approach 1:

The terminal is segmented into multiple conductive paths by introducing slots that divide the terminal body into separate conductive regions. This segmentation creates multiple parallel current paths, reducing the self-inductance effect and minimizing crosstalk between adjacent terminals during high-frequency signal transmission.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent applies local quality by creating slots at specific locations within the terminal structure where self-inductance and crosstalk are most problematic. The slots are strategically positioned to divide the terminal into distinct conductive paths, providing localized optimization for high-frequency signal transmission without affecting the overall terminal arrangement density.

Inventive Principle:
Principle #3Local quality

2Quantity of substance

If terminals are arranged densely to accommodate increasing conductive pads on chip modules, then the conductive pads are arranged increasingly densely, but crosstalk is generated between neighboring terminals

Engineering Contradiction:
Improvequantity of conductive padsVSAvoidcrosstalk between neighboring terminals
Core Design Contradiction:
Quantity of substanceVSObject-generated harmful factors

Solution Approach 1:

The terminal is segmented into multiple conductive paths by introducing slots that divide the terminal body into separate conductive regions. This segmentation creates multiple parallel current paths, reducing the self-inductance effect and minimizing crosstalk between adjacent terminals during high-frequency signal transmission.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The slots act as intermediary elements between adjacent terminals, creating electromagnetic isolation zones that prevent crosstalk. By introducing these intermediate structures, the patent effectively blocks the harmful electromagnetic coupling between densely arranged neighboring terminals while maintaining the high-density pad arrangement.

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS10276953B2Electrical connector
Publication Date: 2019.04.30 LOTES
  • US10276953B2 patent drawing
  • US10276953B2 patent drawing
  • US10276953B2 patent drawing

AI summary

An electrical connector for electrically connecting with a chip module, which includes: an insulating body; and multiple terminals, respectively and correspondingly accommodated in the insulating body. Each terminal has: a base portion having a vertical plane; a first arm, bending and extending upward from the base portion toward a direction away from the vertical plane; a second arm, bending and extending reversely from the first arm and crossing the vertical plane, configured to abut the chip module; and a through-slot, running through the second arm vertically, where the through-slot at least extends to a bending location between the second arm and the first arm, so that the second arm forms two branches at two opposite sides of the through-slot, and the second arm has a beam connecting the two branches, so as to reduce self-inductance of the terminal, and improve a high-frequency signal transmission capability of the electrical connector.