Connector Thermal Diffusing Unit Heat Dissipation
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Solution Overview
Problem
Conventional heat dissipation methods for high-speed data transmission cables, such as AOC and AEC, are inefficient due to the limited thermal conductivity of the metal case, which restricts heat transfer to areas beyond the contact point of thermal paste or sheets, leading to low heat dissipation efficiency.
Innovation Solution
A connector design incorporating a thermal diffusing unit with a larger heat transfer coefficient and area abutting the case's inner surface compared to the heating source, allowing for enhanced heat distribution and dissipation across a broader area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a metal case is used to withstand external forces, then the rigidity is sufficient, but the thermal conductivity is insufficient leading to low heat dissipation efficiency
Solution Approach 1:
The patent introduces a thermal diffusing unit as an intermediary component between the heating source and the metal case. This unit has high thermal conductivity to efficiently transfer heat from the small contact area to a larger area on the case, overcoming the limitation of the metal case's insufficient thermal conductivity while preserving the case's structural rigidity.
Solution Approach 2:
The thermal diffusing unit expands the heat transfer from a one-dimensional point contact to a two-dimensional area distribution. By creating a larger heat conducting area on the case surface, it transforms the heat dissipation from localized to distributed, improving overall efficiency without compromising the case's mechanical strength.
2Loss of energy
If thermal paste or thermal conductive sheet is applied to transfer heat, then heat transfer from heating source is achieved, but the heat can only be transmitted to a limited area of the case
Solution Approach 1:
The thermal diffusing unit serves as a mediator that receives heat from the thermal paste or conductive sheet and redistributes it over a larger area. This intermediary component bridges the gap between the limited contact area and the need for extensive heat dissipation area.
Solution Approach 2:
The patent changes the thermal conductivity parameter by introducing a material with superior thermal properties. The thermal diffusing unit's high thermal conductivity enables it to rapidly spread heat across its surface, transforming the heat distribution pattern from concentrated to dispersed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The thermal diffusing unit effectively increases the heat conducting area and improves heat dissipation efficiency by transferring heat from a small area to a larger one, addressing the limitations of conventional methods.
Implementation Method 1
A heat transfer coefficient of the thermal diffusing unit is larger than a heat transfer coefficient of the case... the thermal diffusing unit is allowed to transmit heat from a small area to a big area
Data Source
AI summary
A connector has a case, a circuit board, and a thermal diffusing unit. The case has an inner surface. The circuit board is mounted in the case and has a heating source. The thermal diffusing unit abuts the inner surface of the case and the heating source of the circuit board. An area of the thermal diffusing unit abutting the inner surface is bigger than an area of the thermal diffusing unit abutting the heating source. A heat transfer coefficient of the thermal diffusing unit is bigger than a heat transfer coefficient of the case. With the structure above, the thermal diffusing unit is allowed to transmit heat from a small area to a big area, thereby improving the heat dissipation efficiency of the connector.