Connector Thermal Plate with Adjustable Biasing for Heat Dissipation
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Solution Overview
Problem
High-power I/O connectors face challenges in thermal management, especially when multiple connectors are ganged or stacked, as conventional heat sinks become insufficient in dissipating the thermal energy generated by active modules.
Innovation Solution
A cage system with a thermal plate and adjustable biasing mechanism, such as a riding heat sink, is used to enhance thermal dissipation by positioning the thermal plate to maximize surface area contact with the module, allowing for effective heat transfer through fins or conduits, even in constrained spaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple connectors are ganged or stacked to increase connectivity, then the data transmission capability is improved, but the thermal management becomes significantly more difficult
Solution Approach 1:
The patent combines multiple heat dissipation functions into a single integrated thermal management system. The thermal plate serves as a common heat dissipation structure for multiple ganged connectors, consolidating what would otherwise require separate cooling solutions for each connector. This merging approach maintains high data transmission capability while simplifying thermal management.
Solution Approach 2:
The thermal plate performs multiple functions simultaneously: it serves as a heat dissipation structure, a mechanical support element, and a biasing surface for maintaining contact pressure. This multi-functionality allows the system to handle thermal management for multiple connectors without proportionally increasing device complexity.
2Loss of energy
If a conventional heat sink is used for a single connector, then the thermal dissipation is sufficient, but it becomes inadequate when connectors are ganged or stacked
Solution Approach 1:
The thermal plate extends in multiple spatial dimensions to provide heat dissipation surfaces for multiple connectors simultaneously. Rather than using separate heat sinks stacked vertically, the thermal plate creates additional heat dissipation areas through lateral extension, allowing the system to scale to multiple connectors while maintaining effective thermal dissipation.
3Loss of energy
If the thermal plate contact area with the module is maximized, then heat transfer efficiency is improved, but the assembly precision requirements increase
Solution Approach 1:
The biasing system dynamically adjusts the contact pressure between the thermal plate and module to ensure optimal thermal contact. This dynamic adjustment compensates for manufacturing tolerances and assembly variations, maintaining high heat transfer efficiency without requiring extremely tight assembly precision. The spring-loaded or elastomeric biasing mechanism continuously applies force to maximize surface contact.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively removes thermal energy from both the top and bottom of the receptacle, providing a substantial surface area for dissipation and maintaining reliable contact, even in configurations with limited airflow or space, thus addressing the thermal management challenges of high-power connectors.
Implementation Method 1
the thermal plate supports a fin... the thermal plate omits fins and is compatible with a convention circuit board layout... providing a substantial surface area for dissipation
Implementation Method 2
The system effectively removes thermal energy from both the top and bottom of the receptacle... allowing for effective heat transfer through fins or conduits
Data Source
AI summary
A cage can include a thermal plate positioned so as to be aligned with a bottom of a channel. An adjustable biasing system is provided to urge a module toward the thermal plate. The adjustable biasing system may be a riding heat sink. The thermal plate may include a fin to help increase its surface area. A housing with a card slot aligned with the channel can be provided in the cage to provide a receptacle that has a card slot aligned with the channel. A receptacle so configured allows for greater thermal energy to be removed from a module.