Connector Voids for Impedance Matching at Small Pitches
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Solution Overview
Problem
Conventional connectors face challenges in achieving matched impedances between differential signal terminals when terminals are arrayed at small pitches, due to the influence of adjacent terminals, which complicates signal transmission and impedance matching.
Innovation Solution
A connector design featuring a body of insulating plastic material with strategically placed voids and recesses that weaken electrical couplings between non-differential signal terminals and strengthen differential couplings between differential signal terminals, facilitating impedance matching by adjusting the dielectric constant and reducing signal delay.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If terminals are arrayed at small pitches to meet demand, then terminal density increases, but impedance matching between differential signal terminals becomes difficult due to influence of adjacent terminals
Solution Approach 1:
The patent introduces voids with different shapes and sizes at different locations within the insulating body. Specifically, first voids are provided between adjacent differential signal terminals, while second voids are provided between differential signal terminals and adjacent non-differential terminals. This localized modification of the insulating body's structure creates different dielectric environments in different regions, allowing impedance matching to be achieved even when terminals are densely arrayed.
Solution Approach 2:
The patent modifies the dielectric constant distribution within the insulating body by introducing voids of different shapes and sizes. By changing the physical structure of the insulating material (from solid to containing voids), the effective dielectric constant is altered in specific regions, which directly affects the impedance characteristics of the terminals. This parameter change enables impedance matching without requiring changes to the terminal geometry or spacing.
2Loss of time
If a recess is provided only around part of one differential signal terminal to resolve signal delay, then signal delay is reduced, but impedance matching between differential signal terminals becomes more difficult
Solution Approach 1:
The patent employs asymmetric void configurations tailored to different terminal types and positions. First voids are positioned between differential signal terminals, while second voids are positioned between differential signal terminals and adjacent non-differential terminals. The voids have different shapes and sizes depending on their location, creating an asymmetric but optimized dielectric environment that simultaneously addresses signal delay and impedance matching requirements.
Solution Approach 2:
Instead of using a uniform recess structure, the patent introduces locally optimized voids with different characteristics at different positions. The first voids are specifically designed to address signal delay between differential pairs, while the second voids are designed to control impedance by managing the electrical coupling between differential and non-differential terminals. This localized quality adjustment resolves both issues simultaneously.
3Loss of time
If plastic material is reduced around one differential signal terminal, then signal delay is reduced, but impedance of that terminal increases while the other remains lower
Solution Approach 1:
The patent introduces voids with different characteristics at different locations to create locally optimized dielectric environments. First voids are positioned between differential signal terminals to reduce signal delay, while second voids are positioned between differential signal terminals and adjacent non-differential terminals to control impedance. This localized quality adjustment ensures that both terminals of a differential pair experience similar impedance conditions, achieving impedance matching while reducing signal delay.
Solution Approach 2:
The patent converts the potentially harmful effect of reduced plastic material (which causes impedance increase) into a beneficial effect by strategically positioning voids. Instead of uniformly reducing material, the voids are placed to weaken electrical coupling between non-differential terminals while preserving or optimizing the differential signal path. This transforms the impedance-matching problem into an opportunity to optimize signal transmission characteristics.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The connector effectively matches impedances between differential signal terminals even at small pitches, improving signal transmission by reducing signal delay and enhancing impedance matching, while also simplifying the manufacturing process through injection molding techniques.
Implementation Method 1
The second portion has a second void in at least a portion thereof. The second void extends from the one first terminal to the second terminal. The third portion has a third void in at least a portion thereof. The third void extends from the other first terminal to the third terminal.
Implementation Method 2
The body includes a first portion between the first terminals, a second portion between the one first terminal and the second terminal, and a third portion between the other first terminal and the third terminal.
Data Source
AI summary
A connector including a pair of first terminals, a second terminal, a third terminal, and a body. The first terminals are differential signal terminals in spaced juxtaposition to each other. The second terminal is located on one side relative to and in spaced relation to one of the first terminals. The third terminal is located on the other side relative to and in spaced relation to the other first terminal. The body holds the terminals at least partially. The body includes a first portion between the first terminals, a second portion between the one first terminal and the second terminal, and a third portion between the other first terminal and the third terminal. The second portion has a second void, which extends from the one first terminal to the second terminal. The third portion has a third void, which extends from the other first terminal to the third terminal.