Connector Wafer Coupling via Segmented Engagement Positions
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Solution Overview
Problem
Small variations in the relative positions of connector wafers due to manufacturing and assembly tolerances can significantly affect the transmission characteristics of electrical connectors, particularly for high-speed signals, making them fragile and unreliable.
Innovation Solution
The coupling means on the connector wafers and coupling pieces are arranged to engage at distinct positions with specific forces, creating interference points for precise alignment, allowing for robust assembly and reduced friction during coupling, thus accommodating larger manufacturing tolerances without compromising engagement force or surface integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the connector wafers are coupled using conventional coupling means with continuous contact surfaces, then the assembly is simple and manufacturing tolerances are accommodated, but the relative positioning of wafers varies due to play between parts, affecting signal transmission characteristics
Solution Approach 1:
The coupling means are segmented into discrete engagement positions along the coupling ridge, transforming the continuous contact surface into distinct engagement points. This segmentation allows precise control over relative wafer positioning while maintaining manufacturing feasibility through standardized discrete features.
Solution Approach 2:
The coupling ridge is designed with varying local properties - specifically, distinct engagement positions with different geometries along its length. These local variations create specific interference patterns at defined locations, enabling precise positioning control without requiring the entire coupling surface to be highly精密.
2Reliability
If the coupling means engage with high force to reduce play between wafers, then the connector becomes more robust, but the assembly process becomes more difficult due to increased friction during coupling
Solution Approach 1:
By segmenting the coupling interface into discrete engagement positions rather than continuous contact, the total friction during assembly is reduced. Each discrete engagement point requires less force to engage, making the overall assembly process easier while still achieving robust connection through the cumulative effect of multiple engagement points.
Solution Approach 2:
The coupling design engages only at specific discrete positions rather than along the entire coupling surface. This partial engagement approach reduces the total friction and force required during assembly, while the strategically positioned engagement points provide sufficient constraint to ensure connector robustness.
3Manufacturing precision
If the connector wafers are positioned with tight tolerances to ensure signal integrity, then high-speed signal transmission is achieved, but manufacturing cost increases and manufacturing complexity increases
Solution Approach 1:
The coupling ridge design incorporates local geometric variations at specific engagement positions that automatically guide and constrain wafer positioning. These localized features create mechanical interference patterns that ensure precise relative positioning without requiring tight tolerances across the entire wafer or coupling structure, thereby reducing manufacturing cost.
Solution Approach 2:
The design changes the positioning mechanism from relying on tight manufacturing tolerances of continuous surfaces to using discrete geometric parameters at specific engagement positions. This parameter change allows standard manufacturing tolerances to be used while still achieving the required positioning precision for high-speed signal transmission.
Data Source
AI summary
An electrical connector is presented, including a plurality of connector wafers coupled by a coupling piece, each wafer including a housing accommodating a plurality of contact elements, said housing having opposite side edges, an insertion side exposing the contact elements, a back side and opposite main faces. The connector wafers are provided with first coupling means extending along at least a portion of a side edge thereof. The coupling piece is provided with second coupling means extending along at least a portion thereof. The first and second coupling means are arranged for engaging each other, in a coupled situation, on a plurality of distinct engagement positions along the respective coupling means.