Shielded Connector Wafer Assembly for EMI and Conductor Alignment
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Solution Overview
Problem
High-speed data connector assemblies face challenges in controlling temperature and maintaining conductor alignment while minimizing electromagnetic interference (EMI) within receptacle cages.
Innovation Solution
The development of compact, high-speed multi-level, multi-port connector assemblies with internal housings made of Liquid Crystal Polymer (LCP) and metal side-plates, featuring alignment and support structures that include protrusions and apertures to fix and align wafer terminals within the same geometrical plane, along with conductive and non-conductive materials to manage temperature and EMI.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If electronic circuits are integrated within plug-modules to enable high-speed data transmission, then data transmission speed is improved, but temperature control becomes difficult
Solution Approach 1:
A thermally conductive, electrically insulating material is introduced as an intermediary between the electronic circuit board and the metal housing. This mediator transfers heat away from the circuit board to the metal housing while electrically isolating the housing from the circuit board, thus resolving the temperature control issue without compromising high-speed data transmission
Solution Approach 2:
The patent changes the thermal and electrical parameters of the housing structure by adding the thermally conductive, electrically insulating material layer. This modifies the heat transfer path and electrical isolation properties, enabling effective temperature management while maintaining signal integrity for high-speed transmission
2Device complexity
If conductors are positioned closely to increase port density, then device compactness is improved, but alignment precision deteriorates
Solution Approach 1:
Alignment features are pre-formed on the wafers and corresponding alignment structures are pre-formed on the housing before assembly. These preliminary alignment features guide the positioning of conductors during assembly, ensuring precise alignment even when ports are densely packed
Solution Approach 2:
The patent introduces alignment features that extend in additional dimensions (such as vertical protrusions and corresponding recesses) beyond the simple planar positioning. This multi-dimensional alignment approach enables precise conductor positioning in high-density configurations
3Strength
If metal housing is used for structural support, then mechanical strength is improved, but electromagnetic interference increases
Solution Approach 1:
The housing structure is designed with locally differentiated properties: metal regions provide mechanical strength and structural support, while thermally conductive, electrically insulating material regions provide electrical isolation. This local quality differentiation allows the housing to simultaneously offer mechanical strength and reduce electromagnetic interference
4Object-generated harmful factors
If electrical isolation structures are added to reduce EMI, then electromagnetic interference is reduced, but device complexity increases
Solution Approach 1:
The thermally conductive, electrically insulating material performs multiple functions simultaneously: it provides electrical isolation to reduce EMI, serves as a thermal management pathway, and acts as a structural bonding interface between the circuit board and housing. This multi-functionality reduces overall device complexity despite adding EMI protection
Data Source
AI summary
Examples of connectors, connector assemblies, and wafer assemblies for improved shielding and thermal performance are described. In one example, a wafer assembly includes a ground path assembly and a row of conductors. The ground path assembly includes a first ground shield and a second ground shield. The row of conductors includes a plurality of communication signal conductors and a plurality of ground conductors arranged in the row of conductors. The first ground shield extends along a first pair of communication signal conductors among the plurality of communication signal conductors and the second ground shield extends along a second pair of the communication signal conductors among the plurality of communication signal conductors.