High Density Electrical Connector Wafer Assembly Grounding
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Solution Overview
Problem
Current electrical connectors struggle to accommodate higher contact densities and faster data transfer speeds without increasing their footprint, which is essential for modern electronic systems with increased circuit complexity and frequency.
Innovation Solution
A high-density electrical connector module design featuring a wafer assembly with conductive members and contact wafers, including signal and ground contacts, where the ground contacts establish a continuous grounding path through a lossy material gasket, ensuring improved electrical performance and reduced signal interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the contact density and data transfer speed are increased, then the electrical performance and data handling capability are improved, but the connector footprint increases
Solution Approach 1:
The patent transitions from planar contact arrangements to a three-dimensional stacked wafer assembly configuration. Multiple contact wafers are stacked vertically with conductive members positioned between them, enabling increased contact density by utilizing the vertical dimension rather than expanding the horizontal footprint. This dimensional transition allows higher data transfer capacity within a compact connector envelope.
2Productivity
If the contact density is increased, then the electrical capability for handling more data is improved, but the signal interference and electrical noise increase
Solution Approach 1:
Conductive members are positioned between adjacent contact wafers to serve as electromagnetic shielding intermediaries. These conductive members act as mediators that block electromagnetic interference and crosstalk between signal contacts on different wafers, enabling high-density contact arrangements while maintaining signal integrity through the inserted shielding elements.
Solution Approach 2:
The grounding gasket provides localized grounding at specific positions where contact wafers are stacked, creating zone-based electromagnetic shielding. Rather than uniform shielding throughout the connector, grounding is applied locally at critical interfaces between wafers, reducing signal interference in high-density regions while maintaining overall electrical performance.
3Area of stationary object
If the connector size is reduced to maintain compact footprint, then the space efficiency is improved, but the manufacturing complexity increases
Solution Approach 1:
The connector is segmented into modular contact wafers that can be manufactured independently and then stacked together. Each wafer contains a subset of contacts and can be produced using standard PCB fabrication processes, reducing overall manufacturing complexity despite the three-dimensional assembly structure. The segmentation allows for standardized production of individual wafers that are then combined into the final compact connector.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables increased signal density without enlarging the connector size, providing effective electrical performance and shielding against signal interference by maintaining a continuous grounding path between printed circuit boards.
Implementation Method 1
The ground contacts of the contact wafers are in electrical contact with both the conductive member and the grounding gasket, thereby defining a grounding path through the connector module
Implementation Method 2
the conductive member or members and the grounding gasket are formed of a lossy material
Data Source
AI summary
A connector module for an electrical connector that has at least one wafer assembly with at least one conductive member and at least one contact wafer. The contact wafer includes a plurality of contacts including at least one signal contact and at least one ground contact. Each of the contacts has a board engagement end configured to engage a printed circuit board and a mating interface end opposite thereof and configured to connect with a contact of a mating connector module. A grounding gasket receives the board engagement ends of the contacts of the wafer assembly. The grounding gasket has at least one portion in electrical contact with the ground contact of the plurality of contacts. The ground contact of the contact wafer is in electrical contact with both the conductive member and the grounding gasket, thereby defining a grounding path through the connector module to the board.