Connector Wipe Impedance Tuning for Faster PCB Signal Transmission
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In information handling systems, the longer the length of connector wipes leads to signal integrity issues due to impedance mismatches and signal reflections, which degrade performance.
Innovation Solution
Implementing a wider section in the connector wipe with a lower impedance and using a dielectric material with a lower dielectric constant beneath the wipe to create an impedance mismatch, reducing stub length and enhancing signal propagation velocity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the connector wipe length is increased to ensure proper contact and mating, then reliability of connection is improved, but signal integrity deteriorates due to impedance mismatches and signal reflections
Solution Approach 1:
The patent changes the physical parameters of the connector wipe by creating a wider section with different impedance characteristics. This wider section has a lower impedance than the standard wipe section, which alters the electrical parameters to reduce signal reflections and improve signal integrity while maintaining adequate contact length for reliable mating.
Solution Approach 2:
The patent applies local quality by creating a specific wider section only in the region where signal reflections are most problematic. This localized modification allows the wipe to maintain standard dimensions in most areas (ensuring reliability) while having a specific section with different electrical properties (reducing reflections). The wider section is positioned strategically between the contact point and the end of the wipe.
2Object-generated harmful factors
If a wider section with lower impedance is implemented in the connector wipe, then signal reflections are reduced, but device complexity increases
Solution Approach 1:
The patent implements parameter changes by modifying the width and impedance of a specific section of the connector wipe. This creates a tapered or expanded region that transitions from the standard wipe width to a wider section, then back to the standard width. The impedance transformation occurs naturally through this geometric transition, reducing the need for additional components or complex structures.
3Speed
If dielectric material with lower dielectric constant is used beneath the connector wipe, then signal propagation velocity increases, but manufacturing precision requirements increase
Solution Approach 1:
The patent applies local quality by placing the lower dielectric constant material specifically in the region beneath the wider section of the connector wipe, where signal propagation needs enhancement. This localized dielectric modification allows the rest of the connector to use standard materials and manufacturing processes, reducing overall precision requirements while still achieving the speed benefit in the critical signal path region.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves signal integrity by minimizing signal reflections and increasing resonance frequency, resulting in a 29% higher resonance frequency and 23% effective stub reduction, thus optimizing signal transmission.
Implementation Method 1
A first area within the dielectric has a second dielectric constant
Data Source
AI summary
A printed circuit board includes a dielectric and a connector. The dielectric has a first dielectric constant. A first area within the dielectric has a second dielectric constant. The connector is mounted on the dielectric. The connector includes a first connector lead mounted on the dielectric, a first contact point above the dielectric, and a first connector wipe. The first connector wipe is disposed above the first area.