Surface Mount Connector Wipe Impedance Tuning for Reflection Cancellation
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Solution Overview
Problem
The impedance mismatch between connector leads and wipes in surface mount connectors leads to signal integrity issues, particularly due to longer connector wipes causing signal reflection and degradation.
Innovation Solution
Implementing a wider section with lower impedance in the connector wipe, combined with a dielectric material change and voids or low dielectric constant materials below the wipe, to create an impedance mismatch and reduce stub length, thereby optimizing signal integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the connector wipe is made longer to improve contact reliability, then the reliability of connector contact is improved, but signal integrity deteriorates due to increased signal reflection and degradation
Solution Approach 1:
The patent changes the impedance parameter along the connector wipe by introducing low impedance bumps at specific locations. This creates an impedance mismatch that generates reflective cancellations, thereby reducing signal degradation while maintaining the longer wipe structure for reliable contact
Solution Approach 2:
The low impedance bumps act as intermediary elements between the connector lead and the connector wipe. These bumps create controlled impedance discontinuities that generate reflective signals to cancel out harmful reflections from the wipe endpoint, solving the signal integrity issue without shortening the wipe
2Object-generated harmful factors
If the connector wipe length is reduced to decrease signal reflection, then signal integrity is improved, but connector contact reliability deteriorates
Solution Approach 1:
Instead of changing the physical length of the connector wipe, the patent changes the electrical impedance parameter by adding low impedance bumps. This allows the wipe to maintain its full length for reliable contact while creating reflective cancellations to reduce signal degradation
Solution Approach 2:
The patent applies local quality changes by placing low impedance bumps at specific locations along the connector wipe rather than uniformly changing the entire wipe structure. This localized modification creates the necessary impedance mismatch for reflective cancellations while preserving the overall wipe length and contact reliability
3Object-generated harmful factors
If low impedance bumps are added to create impedance mismatch and reduce stub length, then signal integrity is improved by minimizing reflections, but device complexity increases
Solution Approach 1:
The patent modifies the electrical parameter (impedance) of the existing connector wipe by adding small low impedance bumps, rather than fundamentally changing the connector architecture. This approach reduces signal reflections while adding minimal structural complexity
Solution Approach 2:
The low impedance bumps create a form of controlled discontinuity in the connector wipe structure, similar to how porous materials introduce controlled variations. These bumps create the necessary impedance mismatch for reflective cancellations with minimal added complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances signal integrity by minimizing signal reflections and increasing resonance frequency, reducing stub length, and improving overall connector performance.
Implementation Method 1
The low impedance bumps create an impedance mismatch between the connector lead and the connector wipe
Implementation Method 2
causing signal reflection to be reduced through reflective cancellations
Data Source
AI summary
A printed circuit board includes a dielectric and a connector. The connector is mounted on the dielectric. The connector includes a first connector lead, a first contact point, and a first connector wipe. The first connector wipe includes a plurality of low impedance bumps. The low impedance bumps create an impedance mismatch between the first connector lead and the first connector wipe.