Connector Assembly Wire Routing Inversion

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

In the miniaturization of products, the existing connector assemblies face challenges due to the need for large space under circuit boards to accommodate wires, leading to excessive bending and stress on bottom-routed wires, which reduces the quality and reliability of the connector assembly.

Innovation Solution

A connector assembly design where wires are routed from above the circuit board, with welding pads on both sides and an insulation covering body, allowing wires to exit from the front side without occupying space underneath, reducing stress and improving reliability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If wires are routed from the back side of the circuit board, then the connector can be installed on the front side, but excessive space is required under the circuit board and wire stress increases

Engineering Contradiction:
Improveconnector installationVSAvoidspace under circuit board
Core Design Contradiction:
Ease of operationVSArea of stationary object

Solution Approach 1:

The patent inverts the conventional wire routing approach by routing wires from the front side of the circuit board instead of the back side. The connector is installed on the front side with welding pads formed on both front and back sides, allowing wires to extend away from the circuit board from above the front side. This inversion eliminates the need for large space under the circuit board and reduces wire stress.

Inventive Principle:
Principle #13The other way round (Inversion)

2Ease of operation

If wires are routed from the back side of the circuit board, then the connector can be installed on the front side, but wire bending and stress increase reducing reliability

Engineering Contradiction:
Improveconnector installationVSAvoidwire connection reliability
Core Design Contradiction:
Ease of operationVSReliability

Solution Approach 1:

The patent inverts the conventional wire routing approach by routing wires from the front side of the circuit board instead of the back side. The connector is installed on the front side with welding pads formed on both front and back sides, allowing wires to extend away from the circuit board from above the front side. This inversion eliminates excessive wire bending and stress, thereby improving wire connection reliability.

Inventive Principle:
Principle #13The other way round (Inversion)

3Volume of moving object

If product miniaturization is pursued, then product size decreases, but available space under circuit board becomes insufficient

Engineering Contradiction:
Improveproduct sizeVSAvoidspace under circuit board
Core Design Contradiction:
Volume of moving objectVSArea of stationary object

Solution Approach 1:

The patent inverts the conventional wire routing approach by routing wires from the front side of the circuit board instead of the back side. The connector is installed on the front side with welding pads formed on both front and back sides, allowing wires to extend away from the circuit board from above the front side. This inversion eliminates the need for large space under the circuit board, enabling product miniaturization without compromising wire routing capabilities.

Inventive Principle:
Principle #13The other way round (Inversion)

Data Source

PatentUS11735847B2Connector assembly
Publication Date: 2023.08.22 TYCO ELECTRONICS (SHANGHAI) CO LTD
  • US11735847B2 patent drawing
  • US11735847B2 patent drawing
  • US11735847B2 patent drawing

AI summary

A connector assembly comprises a circuit board having a front side and a back side, with a connector installed on the front side of the circuit board. A plurality of first welding pads are formed on the front side of the circuit board, and a plurality of second welding pads are formed on the back side of the circuit board. A plurality of wires are connected to the circuit board, with a first portion thereof connected to the first welding pads and a second portion thereof connected to the second welding pads. Each of the plurality of wires extend away from the circuit board from above the front side of the circuit board.