Connector With Embedded Wiring For Display Substrate Bonding

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Solution Overview

Problem

Existing display devices face challenges in reliably and efficiently connecting wiring lines between substrates due to high repulsive forces in flexible printed circuit boards (FPCs) and limitations with conductive pastes, leading to complex connection processes and potential damage to wiring lines.

Innovation Solution

A connector with a resin support member and embedded wiring portions, featuring a stepped structure and communicating grooves, allows for simultaneous thermocompression bonding of junctions to both substrates, reducing the number of bonding steps and preventing damage from substrate edges.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If flexible printed circuit boards (FPCs) are used to connect wiring lines between substrates, then connection flexibility is improved, but high repulsive forces cause connection reliability to deteriorate

Engineering Contradiction:

Improveconnection flexibilityVSAvoidconnection reliability

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The patent introduces a connector as an intermediary component between the first and second substrates. This connector includes a support member with wiring portions that have coupling sections embedded in the support member, first junctions joined to wiring lines of the first substrate, and second junctions joined to wiring lines of the second substrate. The connector mediates the connection, eliminating the high repulsive forces associated with FPCs while maintaining connection flexibility.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Ease of manufacture

If conductive paste is used to connect wiring lines, then connection process simplicity is improved, but connection strength and reliability deteriorate

Engineering Contradiction:

Improveconnection process simplicityVSAvoidconnection strength

Core Design Contradiction:

Ease of manufactureVSStrength

Solution Approach 1:

The patent replaces the chemical bonding mechanism of conductive paste with a mechanical joining system. The connector uses first junctions and second junctions that are joined to wiring lines through thermocompression bonding, providing mechanical and electrical connection. This substitution maintains process simplicity while significantly improving connection strength and reliability.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Reliability

If multiple bonding steps are used to connect wiring lines to both substrates, then connection reliability is improved, but manufacturing complexity and time increase

Engineering Contradiction:

Improveconnection reliabilityVSAvoidmanufacturing process complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges multiple bonding operations into a single thermocompression bonding step. The connector is designed such that both the first junctions and second junctions can be bonded to their respective substrates simultaneously in one operation. This reduces manufacturing complexity and time while maintaining connection reliability through the robust thermocompression bonding process.

Inventive Principle:

Principle #5Merging (Combining)

4Ease of operation

If wiring lines are directly exposed for connection, then connection accessibility is improved, but susceptibility to damage from substrate edges increases

Engineering Contradiction:

Improveconnection accessibilityVSAvoiddamage from substrate edges

Core Design Contradiction:

Ease of operationVSObject-affected harmful factors

Solution Approach 1:

The patent embeds the coupling sections of the wiring portions inside the support member, creating a nested structure. The support member protects the wiring portions and their junctions from damage by substrate edges while maintaining connection accessibility. The connector integrates the wiring portions within its structure, shielding them from external harmful factors.

Inventive Principle:

Principle #7Nested doll (Nesting)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables reliable and efficient connection of wiring lines between substrates, simplifying the manufacturing process and reducing the risk of damage, while allowing for more flexible alignment and easier installation.

Implementation Method 1

allows for simultaneous thermocompression bonding of junctions to both substrates

Methodology Applied

Scientific EffectThermocompression bonding:

Data Source

PatentUS10602615B2Display device

Publication Date: 2020.03.24 MAGNOLIA WHITE CORP

AI summary

According to one embodiment, a display device includes a first substrate provided with electrodes and wiring lines, a second substrate provided with wiring lines and opposing the first substrate, and a connector which connects the wiring lines on the first substrate and the wiring lines on the second substrate. The connector includes a support member formed of a resin and a plurality of wiring portions on the support member, and each wiring portion includes a first junction joined to the wiring lines of the first substrate, a second junction joined to the wiring lines of the second substrate, a coupling section located between the first junction and the second junction and embedded inside of the support member.