Constant Cross-Section Fluid Passage for Uniform Thermal Conduction

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Solution Overview

Problem

Conventional fluid temperature control devices in semiconductor manufacturing suffer from reduced heating/cooling capacity and Peltier module lifespan due to non-uniform fluid flow velocity and thermal conduction, leading to increased thermal resistance and junction temperature variations.

Innovation Solution

A fluid temperature control device with a main body block featuring a passage channel of constant cross-sectional area and spiral shape, connected between inlet and outlet, utilizing a thermal conducting plate and Peltier module for uniform heat exchange, and incorporating a drain passage to prevent fluid stagnation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the passage has a conventional configuration with varying cross-sectional area, then the device structure is simpler to manufacture, but the fluid flow velocity becomes non-uniform causing large pressure loss and reduced heating/cooling capacity

Engineering Contradiction:
Improveheating/cooling capacityVSAvoidpassage structure complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The passage cross-sectional area is designed to be substantially constant along its length, changing the geometric parameter from variable to constant. This maintains uniform fluid flow velocity, reduces pressure loss, and improves heating/cooling capacity without requiring complex variable-area geometry

Inventive Principle:
Principle #35Parameter changes

2Temperature

If the passage has a conventional configuration, then the manufacturing process is simpler, but the thermal conduction between fluid and thermal conducting plate becomes non-uniform increasing thermal resistance

Engineering Contradiction:
Improvetemperature control precisionVSAvoidpassage fabrication ease
Core Design Contradiction:
TemperatureVSEase of manufacture

Solution Approach 1:

By changing the passage cross-sectional area parameter from variable to substantially constant, the fluid flow velocity becomes uniform along the passage length. This ensures uniform thermal conduction between the fluid and thermal conducting plate, reducing thermal resistance and improving temperature control precision

Inventive Principle:
Principle #35Parameter changes

3Reliability

If the passage has a conventional configuration, then the device assembly is easier, but the Peltier module junction temperature varies causing reduced module lifespan

Engineering Contradiction:
ImprovePeltier module lifespanVSAvoidpassage design complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The passage is designed with substantially constant cross-sectional area, which uniformizes the fluid flow velocity and thermal conduction along the passage. This prevents localized temperature variations at the Peltier module junction, reducing thermal stress and extending module lifespan

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design ensures uniform fluid flow and thermal conduction, enhancing temperature control capacity while preventing Peltier module degradation and facilitating efficient heat transfer with reduced pressure loss and extended module lifespan.

Implementation Method 1

a Peltier module (thermoelectric module) M as the temperature control means is attached to an outer surface of each of the thermal conducting plates E

Methodology Applied
Scientific EffectPeltier effect: Peltier Effect

Implementation Method 2

heat exchange between the temperature control means and the treatment solution passing through the passage is carried out by way of the thermal conducting plate E

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

the treatment solution is heated/cooled by the thermal conduction with the thermal conducting plate E

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS7938577B2Fluid temperature control device
Publication Date: 2011.05.10 KELK LTD
  • US7938577B2 patent drawing
  • US7938577B2 patent drawing
  • US7938577B2 patent drawing

AI summary

A fluid temperature control device, which includes: a main body block having a passage channel formed in a surface thereof; a thermal conducting plate that is provided on the surface of the main body block, and covers the passage channel to form a passage for passing a fluid to be temperature controlled; and temperature control means that carries out heat exchanging (heating/cooling), by way of the thermal conducting plate, with the fluid passing through the passage, in which the passage abutting on the thermal conducting plate connects a fluid inlet and a fluid outlet formed in the main body block, and is a single passage having an approximately constant passage cross-sectional area over its entire length.