Construction Element Sandwich Structure for LED Data Transmission
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for integrating electronic components like LEDs into construction elements, such as ceiling panels, are costly and require extensive cabling for data transmission, lacking efficient control and thermal management.
Innovation Solution
A sandwich structure with electrically conducting front and rear layers separated by an insulating layer, incorporating a circuit board between the electronic component and the rear layer for thermal management and data transmission via Direct Current Power Line Communication (DC PLC), allowing for flexible component placement and reduced cabling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If electronic components are integrated into construction elements using prior art methods, then the construction elements can emit light, but extensive cabling is required for data transmission increasing cost and complexity
Solution Approach 1:
The patent combines power transmission and data communication functions into a single electrical connection between the electronic component and the sandwich structure. The sandwich structure serves dual purposes: providing mechanical support and enabling both power supply and data transmission through its conducting layers, eliminating the need for separate data cables.
Solution Approach 2:
The sandwich structure is designed to perform multiple functions simultaneously: structural support, power transmission, and data communication. The front and rear conducting layers are configured to carry both electrical power and data signals, making the structure universal and reducing overall system complexity.
2Ease of manufacture
If electronic components are integrated into construction elements, then light emission functionality is achieved, but thermal management becomes challenging
Solution Approach 1:
The circuit board serves as an intermediary thermal management component between the electronic component and the rear conducting layer. It provides a dedicated thermal pathway that conducts heat away from the electronic component to the rear layer, which acts as a heat sink, without interfering with the electrical and data connections.
3Reliability
If extensive cabling is used for data transmission to electronic components, then reliable data communication is achieved, but cost increases
Solution Approach 1:
The patent merges data transmission with the existing power supply infrastructure. The same electrical connection that provides power to the electronic component also carries data signals bidirectionally, eliminating the need for additional data cables and reducing material quantity.
4Ease of operation
If separate data cables are provided for each electronic component, then individual control is achieved, but installation complexity increases
Solution Approach 1:
The sandwich structure provides a universal interface that handles both power and data for multiple electronic components through a single connection system. Each component communicates with the control system via the shared sandwich structure infrastructure, simplifying installation while maintaining individual control capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the durability and performance of electronic components by effective heat dissipation and simplifies data transmission, reducing costs and cabling complexity while enabling control of multiple components through a central controller.
Implementation Method 1
the first electrical terminal is in electrical connection with the electrically conducting front layer, and the second electrical terminal is in electrical connection with the electrically conducting rear layer
Implementation Method 2
an electrically insulating layer and at least two electrically conducting layers, which comprises an electrically conducting front layer and an electrically conducting rear layer which are spaced apart by an electrically insulating layer
Implementation Method 3
By positioning the circuit board between the electrical component and the electrically conducting rear layer it is possible to obtain a good thermal connection to a heat sink of the electrical component
Data Source
Figure 1~3
Figure 4~5
Figure 6~7
AI summary
The present invention relates to a method of transmitting data to an electronic component (3) comprised by a construction element (100) comprising: providing a sandwich structure comprising an electrically insulating layer (11) and at least two electrically conducting layers, which comprises an electrically conducting front layer (12) and an electrically conducting rear layer (13) which are spaced apart by the electrically insulating layer (11), providing a circuit board (2) for transmission of data between an electronic component (3) and the electrically conducting rear layer (13), positioning the electronic component on the circuit board (2), providing the electronic component with a first and a second electrical terminal, connecting the first electrical terminal with the electrically conducting front layer (12), connecting the second electrical terminal with the electrically conducting rear layer (13), and transmitting a data signal via the electrically conducting front layer and/or the electrically conducting rear layer by means of Direct Current Power Line Communication (DC PLC).