Contact Aperture Profile Modifier to Prevent Void Formation
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Solution Overview
Problem
In semiconductor device manufacturing, voids formed in contact openings between conductive features can adversely affect electrical connections, leading to manufacturing yield issues and connection reliability.
Innovation Solution
A semiconductor device structure and method that incorporates a profile modifier within the aperture defined by metallization lines and isolation features, which modifies the aperture profile to accommodate a contact feature with a partial circle, ellipse, or oval shape, reducing void formation when filled with conductive material.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional rectangular aperture is used for contact features, then the manufacturing process is simple, but voids are formed in the contact openings adversely affecting electrical connection
Solution Approach 1:
The patent applies curvature by transitioning from a rectangular aperture to a rounded aperture with curved corners. This spherical/curved geometry eliminates the sharp corners that cause void formation during conductive material filling, thereby improving electrical connection reliability while maintaining manufacturing feasibility
Solution Approach 2:
The patent introduces a profile modifier layer as an additional dimensional element between the aperture definition layer and the conductive material filling layer. This intermediate dimension allows the aperture profile to be modified from rectangular to rounded without changing the fundamental rectangular layout, resolving the contradiction between simplicity and reliability
2Productivity
If a rectangular aperture profile is used, then the manufacturing process is straightforward, but voids form during conductive material filling
Solution Approach 1:
The profile modifier is formed in advance before the conductive material filling step. This preliminary action of pre-modifying the aperture profile ensures that when conductive material is deposited, it naturally fills the rounded aperture without voids, thereby improving manufacturing yield without complicating the overall manufacturing process
Solution Approach 2:
The profile modifier acts as an intermediary element that mediates between the rectangular aperture definition and the conductive material filling process. This intermediate layer enables the transition from simple rectangular geometry to optimized rounded geometry, improving yield while maintaining ease of manufacture through a straightforward multi-layer structure
Data Source
AI summary
A semiconductor device structure and method for manufacturing the same are provided. The semiconductor device structure includes a first metallization line, a second metallization line, a first isolation feature, a second isolation feature, a profile modifier, and a contact feature. The first metallization line and the second metallization line extend along a first direction. The first isolation feature and the second isolation feature are disposed between the first metallization line and the second metallization line. The first metallization line, the second metallization line, the first isolation feature and the second isolation feature define an aperture. The profile modifier is disposed within the aperture to modify a profile of the aperture in a plan view. The contact feature is disposed within the aperture.