Low Inductance Contact Assembly Manufacturing Process
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Solution Overview
Problem
Current electrical contact assemblies in integrated circuit testing apparatuses face challenges with high inductance, size limitations, complexity, and inability to handle high currents and temperatures, making them unsuitable for high-frequency and tri-temperature testing in applications like IoT and automotive industries.
Innovation Solution
A manufacturing process for an electrical contact assembly using an assembly jig with C-shaped inner and outer pins, guided by teeth sections, and secured with epoxy, allowing for a robust, low-inductance design that can handle high frequencies and currents, and withstand extreme temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If standard Kelvin contact assemblies are used with size 3mm and larger for easier handling, then ease of operation is improved, but inductance increases to 3nH or higher which limits high frequency testing capability
Solution Approach 1:
The contact assembly is divided into multiple contact elements (inner contacts and outer contacts) arranged in a compact grid pattern. This segmentation allows the total contact area to be reduced while maintaining handling ease through the structured arrangement, achieving low inductance without sacrificing operational ease.
Solution Approach 2:
The contact assembly uses a nested structure where inner contacts are surrounded by outer contacts, with each contact type providing complementary functions. The inner contacts provide primary electrical connection while outer contacts provide shielding and additional connection paths, creating a compact nested arrangement that reduces overall inductance while maintaining ease of handling.
2Object-affected harmful factors
If spring probe designs are used to achieve very small sizes below 3mm, then inductance is reduced, but device complexity increases with at least 3 separate parts making assembly harder and reliability lower
Solution Approach 1:
Multiple contact functions are merged into a single integrated contact assembly structure. The inner contacts, outer contacts, and supporting framework are combined into one unified component that can be installed as a single unit, reducing the number of separate parts while maintaining low inductance characteristics.
Solution Approach 2:
The contact assembly is designed to perform multiple functions simultaneously: electrical connection, signal transmission, shielding, and mechanical support. This multi-functionality is achieved within a single integrated structure, eliminating the need for separate components and reducing overall device complexity.
3Object-affected harmful factors
If spring probe designs with complex multi-part structures are used to reduce size, then inductance is reduced, but reliability decreases due to more parts being prone to faults
Solution Approach 1:
Multiple contact functions are merged into a single integrated contact assembly structure. The inner contacts, outer contacts, and supporting framework are combined into one unified component that can be installed as a single unit, reducing the number of separate parts while maintaining low inductance characteristics.
4Object-affected harmful factors
If rigid pins with compressible elastomer are used to achieve low inductance, then inductance is reduced, but temperature resistance decreases due to elastomer break-down at high temperatures
Solution Approach 1:
The material parameters of the contact assembly are optimized for high-temperature performance. Instead of using compressible elastomers that break down at high temperatures, the invention uses rigid pins with controlled mechanical properties and alternative compliance mechanisms that maintain structural integrity and low inductance across extreme temperature ranges from -55°C to +125°C.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The process enables the production of small-sized electrical contacts with low inductance, ease of assembly and maintenance, and the ability to handle high currents and temperatures, facilitating effective testing across a wide range of frequencies and temperatures.
Implementation Method 1
epoxy is applied, which when cured, secures the inner holder to the plurality of inner pins
Implementation Method 2
A heat curing process is also employed to assist with the curing of the epoxy
Data Source
AI summary
A manufacturing process for an electrical contact assembly that uses an assembly jig with a middle horizontal lip adapted to fit into a plurality of C-shaped inner contact pins, as well as top and bottom guide teeth that guide top and bottom parts of the inner pins as they are being assembled. An inner holder then covers the inner pins, at which point epoxy is applied, which when cured, secures the inner holder to the plurality of inner pins. Outer contact pins in turn cover the outside of the inner holder, and an outer holder covers the outer contact pins. Epoxy is also applied between the outer holder and outer pins, which when cured, secures the outer holder to the plurality of outer pins. A heat curing process is also employed to assist with the curing of the epoxy, during which a clamp temporarily holds the assembly in place.