Contact Bump Connection Radial Interlocking Adhesive-Free
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Solution Overview
Problem
Existing contact bump connections for chip and substrate connections require additional adhesives for mechanical security, limiting production numbers due to curing time constraints and not achieving satisfactory tensile strength.
Innovation Solution
A method where contact bumps with a raised edge and displacement pin are pressed into a contact material, applying radial inward and outward pressure to create a mechanical connection without additional materials, enhancing tensile strength through radial interlocking and compressive forces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If adhesive is used to achieve mechanically durable contacting, then tensile strength is improved, but production time deteriorates
Solution Approach 1:
The contact bump structure is self-sufficient, creating its own mechanical interlocking through the displacement of contact material into the displacement space. The elevated surface and displacement pin work together to form a self-reinforcing connection that achieves both shear and tensile strength without requiring external adhesive materials or curing processes
Solution Approach 2:
The adhesive layer is completely removed from the system. The patent extracts the bonding function from chemical adhesion and replaces it with pure mechanical interlocking through the specialized contact bump geometry and contact material displacement, eliminating the curing time constraint
2Productivity
If contact bumps are pressed into contact material without additional materials, then production speed is improved, but connection durability deteriorates
Solution Approach 1:
The contact bump connection is enhanced by adding vertical dimensionality through the displacement space and bead crown formation. Instead of simple surface contact, the contact material is displaced vertically into the displacement space, creating multi-level mechanical interlocking that significantly improves connection durability while maintaining production speed
Solution Approach 2:
The connection is formed as a composite structure combining the contact bump material, displaced contact material, and the geometric features (elevated surface, displacement pin, bead crowns). This composite structure achieves superior mechanical properties compared to simple material contact, ensuring durability without requiring additional adhesive materials
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method produces a durable mechanical connection resistant to mechanical loads without adhesives, allowing for higher production rates and improved tensile strength, as the connection is formed through radial penetration and interlocking, effectively addressing the limitations of existing technologies.
Implementation Method 1
the contact material of the second connection surface in the displacement space of the contact bump is acted upon both by the edge elevation radially inwards and by the displacement pin radially outwards with pressure
Implementation Method 2
to prevent the advantageous radial clinging or penetration of the contact material, which has already been explained in detail above, to or in the radially outwardly delimiting by the edge elevation in the displacement space
Data Source
Figure 1~3
Figure 4~6
AI summary
The invention relates to a contact bump connection (24) and to a method for producing a contact bump connection between an electronic component provided with at least one terminal face (11) and a contact substrate (26) contacted with the component and having at least one second terminal face (25), wherein the first terminal face is provided with a contact bump (10) which has a raised edge (15) and has at least one displacement pin (16) in a displacement compartment (18) which is surrounded by the raised edge and is open towards a head end of the contact bump, and in a contact region (31) with the first terminal face the second terminal face has a contact bead (30) which is formed by displacement of a contact material (29) of the second terminal face into the displacement compartment and surrounds the displacement pin, wherein said contact bead has a bead crown (33) which is directed to a base (17) of the displacement compartment and is raised relative to a level contact surface (32) of the second terminal face surrounding the contact region.