Contact Carrier Surface Structure for Solder Flow Control
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Solution Overview
Problem
Existing low-voltage protective switching devices face issues with the reliability of solder joints between contact carriers and contact elements, leading to potential failures due to raised solder portions and increased contact resistance.
Innovation Solution
A contact carrier with a contacting area featuring a rough surface structure and channel-like depressions is used to manage solder flow during soldering, reducing the raised solder portion and enhancing the binding component of the solder connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a soldering process is used to fasten the contact element on the contact carrier, then good strength of the join is obtained, but raised solder portions protrude laterally below the contact element which adversely affect reliability
Solution Approach 1:
The contacting area is provided with a rough surface structure specifically at the location where contact element meets contact carrier. This localized surface treatment creates anchor points for the solder to penetrate and bond mechanically, improving joint strength without affecting the entire component surfaces.
Solution Approach 2:
Channel-like depressions are introduced into the contacting area to create a three-dimensional structure that captures and contains the solder material. These depressions provide vertical containment for the solder, preventing it from flowing laterally outward and forming raised portions that could cause reliability issues.
2Reliability
If the contacting area has a rough surface structure, then the binding component of the solder connection is increased, but the manufacturing complexity increases
Solution Approach 1:
The contacting area is given a rough surface structure that creates a porous or micro-irregular topology. This roughness provides increased surface area and mechanical interlocking points for the solder, enhancing the binding component of the connection without requiring complex additional components or structures.
3Reliability
If channel-like depressions are added to delimit the contacting area, then raised solder portions are reduced, but the manufacturing process becomes more complex
Solution Approach 1:
The contacting area is segmented into multiple regions by introducing channel-like depressions that divide and compartmentalize the space. These channels act as barriers that segment the solder flow paths, confining the solder within specific zones and preventing it from accumulating and rising laterally to form problematic raised portions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly improves the quality of the solder joint and reduces the likelihood of device failure by minimizing solder protrusions and increasing the reliability of the joining process.
Implementation Method 1
the contacting area is provided with a rough surface structure... the binding component of the solder connection is considerably increased
Implementation Method 2
the first channel-like depression serves as a further solder depot, i.e. as receiving volume, into which excess solder material can flow in order to prevent the solder material from rising from one or more of the side faces of the contact element
Implementation Method 3
The contact element, with its bottom side placed onto the contacting area formed on the contact carrier, is heated by means of electric current
Data Source
AI summary
A contact carrier serves for fastening a contact element of a low-voltage protective switching device by a soldering operation, so that a solder layer is formed between the contact carrier and the contact element. The contact carrier has a contacting area for the solder layer, the contacting area for its part having a rough surface structure and being delimited by a first groove-like depression. As a result of the rough surface structure of the contacting area and the first groove-like depression, when the contact element is being fixed on the contact carrier by soldering, the solder flux can be specifically influenced to the effect that rising up of the solder at the sides of the contact element is avoided, or at least significantly reduced. The quality of the soldered connection, and consequently the reliability of the soldering process, are significantly improved in this way.