Contact Check Circuitry for Reliable Semiconductor Probe Testing
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Solution Overview
Problem
In electronic products, the dynamic reprogramming of semiconductor devices using electronic fuses is hindered by the inability to ensure proper contact between testing probes and pads during the e-fuse burning operation, leading to unreliable test results.
Innovation Solution
A semiconductor device with integrated contact check circuitry that uses voltage detection and comparison circuits to generate a check result signal, indicating whether contact connections between pads and probes are proper, thereby enhancing test reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If contact check circuitry is integrated into the semiconductor device, then test reliability is improved, but device complexity increases
Solution Approach 1:
The contact check circuit is integrated within the semiconductor device package, merging the contact verification function with the existing semiconductor structure. This integration allows the contact check functionality to be embedded alongside the e-fuse circuitry, enabling reliable contact detection without requiring entirely separate external testing equipment.
Solution Approach 2:
The contact check circuit serves multiple functions: it detects probe contact status, validates pad connectivity, and provides test reliability assurance all through a single integrated system. The circuit can operate during e-fuse burning operations and potentially other testing scenarios, making it a multi-functional component that addresses various testing needs.
2Measurement precision
If voltage detection and comparison circuits are added to check contact connections, then measurement precision is improved, but device complexity increases
Solution Approach 1:
The invention replaces complex mechanical contact verification methods with electrical voltage detection and comparison. Instead of using mechanical probes or physical inspection methods, the system uses voltage signals applied to pads and compares detected voltages against reference values to determine contact status, providing precise electrical measurement of contact conditions.
Solution Approach 2:
The contact check circuit monitors voltage parameters at different pads and compares them against reference voltage levels. By detecting changes in voltage parameters and comparing them to predetermined thresholds, the circuit can precisely determine whether proper contact exists, using parameter comparison rather than complex structural analysis.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The contact check circuitry ensures accurate detection of proper contact connections, preventing faulty test results and ensuring the semiconductor device can proceed with e-fuse burning operations only when connections are valid, thus enhancing the reliability of semiconductor testing.
Implementation Method 1
a voltage detection circuit and a comparison circuit. The voltage detection circuit, coupled to the first pad and the second pad, is used for generating at least one voltage detection signal
Implementation Method 2
The comparison circuit, coupled to the voltage detection circuit, is used for generating the check result signal according to the at least one voltage detection signal and the at least one reference signal
Data Source
AI summary
A semiconductor device with contact check circuitry is provided. The semiconductor device includes a plurality of pads, an internal circuit, and a contact check circuit. The plurality of pads includes a first pad and a second pad. The internal circuit is coupled to the plurality of pads. The contact check circuit, at least coupled to the first pad and the second pad, is used for checking, when the semiconductor device is under test, contact connections to the first pad and the second pad to generate a check result signal according to comparison of a first test signal and a second test signal received from the first pad and the second pad with at least one reference signal.