Contact Clip for Semiconductor Devices
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing electronic components with multiple semiconductor devices face challenges in efficient electrical connection and compact packaging, leading to increased electrical resistance and inductive losses due to traditional bond wire connections.
Innovation Solution
The use of a single contact clip to electrically connect the load electrodes of multiple semiconductor devices to a common leadframe lead, providing a compact internal rewiring structure and reducing electrical resistance by increasing the cross-sectional area of the connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional bond wire connections are used to electrically connect semiconductor devices to the leadframe, then the packaging structure is simple and easy to manufacture, but the electrical resistance increases and inductive losses occur
Solution Approach 1:
The patent merges multiple bond wire connections into a single contact clip structure that electrically connects multiple semiconductor devices to the leadframe. This consolidation reduces the total number of electrical connections, thereby decreasing cumulative electrical resistance and inductive losses while maintaining manufacturing feasibility through a unified contact element.
Solution Approach 2:
The contact clip transitions from the linear, thin-wire geometry of bond wires to a planar or three-dimensional structure with increased cross-sectional area. This dimensional change allows for larger effective contact areas and shorter current paths, reducing electrical resistance and inductive effects while still enabling easy integration into the packaging process.
2Reliability
If multiple bond wire connections are used to connect load electrodes of multiple semiconductor devices, then electrical connection is achieved, but the device complexity and rewiring structure increase
Solution Approach 1:
The patent combines multiple separate bond wire connections into a single integrated contact clip that simultaneously connects to multiple load electrodes and the leadframe. This merging simplifies the rewiring structure by replacing numerous individual wire bonds with one unified contact element, reducing structural complexity while maintaining reliable electrical connections across all semiconductor devices.
Solution Approach 2:
The contact clip serves multiple functions simultaneously: it electrically connects multiple semiconductor devices to the leadframe, provides mechanical support, and establishes multiple electrical pathways through a single component. This multi-functionality reduces the overall complexity of the rewiring structure compared to using separate bond wires for each connection.
3Loss of energy
If a single contact clip is used to electrically connect multiple semiconductor devices to the leadframe, then electrical resistance is reduced by increasing cross-sectional area, but the contact clip structure becomes more complex
Solution Approach 1:
The contact clip utilizes increased cross-sectional area and three-dimensional geometry to reduce electrical resistance. By transitioning from thin wire bonds to a broader, planar or volumetric structure, the contact clip provides multiple parallel current pathways and larger contact surfaces, thereby reducing resistance while the structured design maintains manufacturability.
Solution Approach 2:
The contact clip is designed with segmented or multi-region geometry that provides different functional zones: contact regions for connecting to semiconductor load electrodes, connection regions for bonding to the leadframe, and conductive pathways linking them. This segmentation allows the structure to reduce electrical resistance through increased cross-sectional area while maintaining a systematic, manufacturable form.
Data Source
AI summary
An electronic component has at least two semiconductor devices, a contact clip and a leadframe with a device carrier portion and a plurality of leads. The contact clip extends between the first side of at least two semiconductor devices and at least one lead of the leadframe to electrically connect a load electrode of the at least two semiconductor devices to at least one lead.