Contact-Coupled Package Assembly for Low-Parasitic Interconnects
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Solution Overview
Problem
The performance of integrated devices is limited by the distance currents have to travel between capacitors and dies in existing package configurations, leading to parasitic effects and increased form factor.
Innovation Solution
Implementing contact to contact coupling between packages, utilizing oxide to oxide and copper to copper hybrid bonding to reduce the distance between integrated and passive devices, thereby reducing parasitic effects and form factor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional packaging methods with separate housings are used, then each package can be independently manufactured and tested, but the final assembly requires complex alignment and increases the risk of damage to exposed conductive elements
Solution Approach 1:
The patent merges the housing structures of multiple packages into a single integrated housing that contains all packages. This integration eliminates the need for separate alignment operations between individual package housings, as they are pre-aligned during manufacturing. The exposed conductive elements from different packages are brought into proximity within this shared housing, enabling direct contact coupling without complex external alignment procedures.
2Speed
If packages are closely coupled with exposed conductive elements facing each other, then signal transmission is improved, but the risk of damage to conductive elements and contamination increases
Solution Approach 1:
The patent implements protective measures before the conductive elements are brought into contact. Mates or protective coatings are applied to the exposed conductive elements during package manufacturing, prior to final assembly. This beforehand protection prevents damage and contamination that would otherwise occur during the coupling process, while still allowing for high-speed signal transmission once protected elements are in contact.
3Manufacturing precision
If multiple packages are integrated into a single housing, then alignment precision is improved, but the housing size and manufacturing complexity increase
Solution Approach 1:
The patent arranges packages in a nested or compact configuration within the shared housing. Packages are positioned to utilize available space efficiently, with conductive elements oriented to minimize the overall housing dimensions. This nesting approach achieves precise alignment of multiple packages while controlling the total volume of the housing, avoiding excessive size increases.
Data Source
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AI summary
A device that includes a first package and a second package coupled to the first package. The first package includes a first integrated device, a first encapsulation layer encapsulating the first integrated device, a plurality of vias traveling through the first encapsulation layer, a first redistribution portion comprising a first plurality of redistribution interconnects, wherein the first redistribution portion is coupled to the first encapsulation layer, and a first plurality of contacts coupled to the first integrated device. The second package includes a passive device, a second encapsulation layer encapsulating the passive device, a second redistribution portion comprising a second plurality of redistribution interconnects, wherein the second redistribution portion is coupled to the passive device and the second encapsulation layer, and a second plurality of contacts coupled to the passive device, wherein the second plurality of contacts is coupled to the first plurality of contacts from the first package.