Contact Force Sensor Package for Blood Pressure Measurement
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Solution Overview
Problem
Conventional contact force sensor packages for blood pressure measurement are bulky and have reduced sensitivity due to the thickness of the bonding wire and increased distance between the radial artery and the detection unit, leading to potential disconnection and decreased detection accuracy.
Innovation Solution
A compact contact force sensor package design featuring a substrate layer with a vibration detection unit, a flexible circuit substrate layer, an adhesion layer, and a vibration transfer unit made of elastic material, which reduces the distance between the radial artery and the detection unit, enhancing sensitivity and durability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the silicon gel thickness is increased to protect the bonding wire from disconnection, then the reliability of the bonding wire is improved, but the size of the contact force sensor package increases and the sensitivity of sphygmus wave detection deteriorates
Solution Approach 1:
The patent removes the bonding wire from the structure by directly mounting the substrate layer containing the thin film onto the circuit substrate layer without wire bonding. This eliminates the need for thick protective silicon gel, allowing the gel to be kept thin for maintaining detection sensitivity while still providing necessary protection to the thin-film structure.
Solution Approach 2:
The patent transitions from a wire-bonding connection method to a direct mounting method, changing the dimensional arrangement of components. The substrate layer is directly positioned and fixed onto the circuit substrate layer, eliminating the vertical space required for thick bonding wire and associated protective gel.
2Volume of moving object
If the bonding wire is made thinner to reduce size, then the size of the contact force sensor package is reduced, but the bonding wire becomes more vulnerable to impact and disconnection
Solution Approach 1:
The patent completely removes the bonding wire from the system by implementing direct mounting of the substrate layer onto the circuit substrate layer. This eliminates the trade-off between wire thickness and package size, as the connection is achieved through direct physical and electrical contact without intermediate wire structures.
3Reliability
If the distance between the radial artery and the thin film is increased to provide protection, then the protection of the thin film is improved, but the sensitivity of sphygmus wave detection is deteriorated
Solution Approach 1:
The patent changes the protective approach from increasing vertical distance to using a thin layer of silicon gel that provides protection through material properties rather than thickness. The thin film remains close to the contact surface, maintaining sensitivity while the gel layer provides necessary environmental protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design improves sphygmus wave detection sensitivity and reduces the size of the sensor package, allowing for more accurate and reliable blood pressure measurement while minimizing the risk of disconnection and measurement errors.
Implementation Method 1
a vibration transfer unit having one side contacting the vibration detection unit and the other side contacting a human body and transferring a sphygmus wave of the human body to the vibration detection unit
Implementation Method 2
The vibration transfer unit is formed of an elastic material
Implementation Method 3
an adhesion layer formed between the substrate layer and the flexible circuit substrate layer to reinforce a junction force between the substrate layer and the flexible circuit substrate layer
Implementation Method 4
a substrate layer having a thin film 55... blood pressure is measured through a change of the thin film 55
Data Source
AI summary
A contact force sensor package includes a substrate layer having a vibration detection unit and a pair of first junction pads that are electrical connection ports which are provided on an upper surface of the substrate layer, a flexible circuit substrate layer having a pair of second junction pads provided at a position corresponding to the first junction pads and electrically connected to the first junction pad, a vibration transfer unit having one side contacting the vibration detection unit and the other side contacting a human body and transferring a sphygmus wave of the human body to the vibration detection unit, and an adhesion layer formed between the substrate layer and the flexible circuit substrate layer to reinforce a junction force between the substrate layer and the flexible circuit substrate layer, the adhesion layer being not formed in an area overlapping at least the vibration transfer unit.