Contact Lens Sensor Orientation for Sensitivity

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

The sensitivity and reaction time of sensors embedded in contact lenses are compromised due to excessive contact lens forming polymer (CLF) coverage, which is dictated by the height of the chip and sensor location, leading to reduced performance in sensing applications.

Innovation Solution

The electronics substrate is positioned and angled within the contact lens such that the sensor is closer to the edge, reducing the thickness of CLF polymer over the sensor, while the chip is positioned further from the edge with more CLF polymer coverage, optimizing sensor sensitivity and reaction time.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the electronics substrate is positioned with the sensor at the base of the contact lens, then the sensor is well-supported within the CLF polymer, but the thickness of CLF polymer over the sensor is excessive, reducing sensitivity and reaction time

Engineering Contradiction:
Improvesensor support stabilityVSAvoidsensor sensitivity
Core Design Contradiction:
ReliabilityVSMeasurement precision

Solution Approach 1:

The electronics substrate is rotated 90 degrees relative to the base of the contact lens, changing the spatial orientation from a vertical arrangement (sensor at base) to a horizontal arrangement (sensor near edge). This dimensional change allows the sensor to be positioned where CLF polymer thickness is minimized, improving sensitivity while maintaining structural support through the substrate itself.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Measurement precision

If the sensor is positioned near the edge of the contact lens, then the CLF polymer thickness over the sensor is reduced, improving sensitivity, but the sensor may lack adequate support

Engineering Contradiction:
Improvesensor sensitivityVSAvoidsensor support stability
Core Design Contradiction:
Measurement precisionVSReliability

Solution Approach 1:

The electronics substrate provides localized support specifically to the sensor region, allowing the sensor to be positioned near the edge where CLF polymer thickness is reduced. The substrate acts as a local support structure that compensates for the reduced CLF polymer coverage, maintaining sensor stability while enabling improved sensitivity through minimal polymer interference.

Inventive Principle:
Principle #3Local quality

3Adaptability or versatility

If the chip height is increased to improve electronic functionality, then more CLF polymer coverage is required, but this increases the thickness of CLF polymer over the sensor, reducing sensing performance

Engineering Contradiction:
Improveelectronic functionalityVSAvoidsensing accuracy
Core Design Contradiction:
Adaptability or versatilityVSMeasurement precision

Solution Approach 1:

Rotating the electronics substrate 90 degrees changes the vertical stacking arrangement to a horizontal layout, separating the chip and sensor in the radial direction rather than stacking them vertically. This allows the chip to have sufficient height for functionality while the sensor remains positioned where CLF polymer thickness is minimal, eliminating the trade-off between chip height and sensor sensitivity.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS9176332B1Contact lens and method of manufacture to improve sensor sensitivity
Publication Date: 2015.11.03 VERILY LIFE SCIENCES LLC
  • US9176332B1 patent drawing
  • US9176332B1 patent drawing
  • US9176332B1 patent drawing

AI summary

Contact lenses and methods of manufacture are provided. A contact lens can include: an electronics substrate having components formed thereon and disposed within a contact lens forming (CLF) polymer, wherein a first one of the components is positioned at a first region of the electronics substrate and a second one of the components is positioned at a second region of the electronics substrate, the second region being opposite the first region; and a plurality of CLF polymer layers molded such that the plurality of CLF polymer layers has a first thickness in a region of the electronics substrate associated with the first one of the components and has a second thickness in a region of the electronics substrate associated with the second one of the components.