Overmolded Contact Module Stabilizing Signal Contacts

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Solution Overview

Problem

Conventional contact modules experience signal integrity issues due to lateral movement of conductors during the overmolding process, which affects the precise positioning of signal contacts in electrical systems like network switches and computer servers.

Innovation Solution

The contact module design incorporates a frame assembly with removable inserts that hold the receptacle signal contacts in place during overmolding, ensuring their lateral positions are maintained, and dielectric inserts fill the gaps to cover the contacts, preventing movement and maintaining signal integrity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional overmolding process is used with pinch pins, then the contact module can be manufactured, but the conductors experience lateral offset from designed nominal position causing signal integrity issues

Engineering Contradiction:
Improveconductor positioning precisionVSAvoidsignal integrity
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The patent introduces removable inserts as intermediary components that are placed in the mold during overmolding. These inserts act as mediators between the dielectric material and the conductors, providing a stable reference structure that prevents conductor movement. The inserts are removed after overmolding to leave cavities that are subsequently filled with dielectric material, thereby eliminating the harmful effect of conductor lateral offset while maintaining manufacturing feasibility.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent applies preliminary action by pre-positioning the removable inserts in the mold before the overmolding process begins. These inserts are strategically placed to hold the conductors in their correct positions during the incoming dielectric material. By performing this positioning action beforehand, the patent prevents lateral offset from occurring during overmolding, thus ensuring signal integrity without requiring complex real-time adjustments.

Inventive Principle:
Principle #10Preliminary action

2Ease of manufacture

If dielectric material is injected into the mold during overmolding, then the frame members are formed, but the dielectric material presses against the conductors and causes them to move

Engineering Contradiction:
Improveovermolding processabilityVSAvoidconductor position accuracy
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The removable inserts serve as intermediaries that allow the dielectric material to be injected without directly pressing against the conductors. The inserts are positioned around the conductors and extend into the mold cavity, creating a barrier that prevents the incoming dielectric material from contacting and displacing the conductors. This intermediary structure enables the overmolding process to proceed while maintaining conductor position accuracy.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent applies preliminary anti-action by introducing the removable inserts that preemptively counteract the harmful pressing force of the dielectric material. These inserts are placed in position before the overmolding process, and they exert a counter-force or physical barrier against the incoming dielectric material, preventing it from pressing against and moving the conductors. This preliminary protective measure eliminates the need for complex real-time force balancing during injection.

Inventive Principle:
Principle #9Preliminary anti-action

Data Source

PatentUS8974253B2Contact module for a receptacle assembly
Publication Date: 2015.03.10 TE CONNECTIVITY NEDERLAND
  • US8974253B2 patent drawing
  • US8974253B2 patent drawing
  • US8974253B2 patent drawing

AI summary

A contact module includes an overmolded leadframe with frame members separated by corresponding gaps and a removable insert coupled to a corresponding receptacle signal contacts. The removable insert has a main wall, end walls extending from the main wall and forming a receiving space therebetween, and a finger extending from the main wall in the receiving space. First and second channels are formed between the finger and the corresponding end walls that receive the contacts. The finger and end walls hold the lateral positions of the contacts during the overmolding process. The receiving space is filled with dielectric material during overmolding and the removable insert leaves a window in the corresponding frame member that exposes the corresponding receptacle signal contacts.