Contact Module Stack Lossy Material Resonance Absorption
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Solution Overview
Problem
Existing communication connectors face performance issues with high data rates due to noise from cross-talk and return loss, particularly in small pitch high speed data connectors, where the close proximity of signal and ground contacts leads to reduced connector performance and throughput.
Innovation Solution
A contact module stack arrangement with signal and ground contact modules, where the ground contact modules incorporate lossy material with conductive particles in a dielectric binder to absorb electrical resonance, reducing noise and improving signal integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If ground contacts are placed in close proximity to signal contacts to improve shielding, then signal integrity should improve, but return loss increases and noise from cross-talk worsens
Solution Approach 1:
The patent applies local quality by implementing a ground-signal-signal-ground contact module arrangement where ground contacts are positioned adjacent to signal contacts in specific locations. This localized grounding provides targeted shielding and reference planes exactly where needed for high-speed signals, improving signal integrity without requiring ground contacts throughout the entire connector structure, thereby avoiding excessive return loss.
Solution Approach 2:
The patent utilizes composite materials by incorporating lossy material with conductive particles in a dielectric binder material into the ground contact modules. This composite structure absorbs electrical resonance and reduces cross-talk noise while maintaining the grounding function, effectively resolving the contradiction between needing close ground-signal proximity for shielding and avoiding return loss and noise generation.
2Productivity
If small pitch connectors are used to increase data transmission speed, then productivity improves, but noise and return loss increase reducing performance
Solution Approach 1:
The patent applies segmentation by dividing the connector into distinct contact modules, each containing specific arrangements of signal and ground contacts. This modular segmentation allows for optimized signal routing and grounding within each module, enabling small pitch configurations that maintain signal integrity through controlled impedance and reduced crosstalk, thereby achieving high data transmission speeds without sacrificing performance.
Solution Approach 2:
The patent introduces lossy material as an intermediary substance within the ground contact modules. This material acts as a mediator that absorbs electrical resonance and reduces electromagnetic interference between closely-spaced small pitch contacts, enabling high-speed data transmission while maintaining reliable connector performance despite the reduced spacing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of lossy material in ground contact modules effectively absorbs electrical resonance, reducing return loss and enhancing the overall performance and throughput of high-speed data connectors by minimizing noise interference.
Implementation Method 1
The lossy layers are manufactured from lossy material having conductive particles in a dielectric binder material, the lossy layers absorbing electrical resonance propagating through the contact module stack
Data Source
AI summary
A contact module stack includes signal contact modules and ground contact modules flanking the signal contact modules in a ground-signal-signal-ground contact module arrangement. The signal contact modules each include signal leadframes and signal dielectric bodies. The ground contact modules each include ground leadframes and ground dielectric bodies. The ground leadframes each have at least one ground contact. Each ground dielectric body has a low loss layer on a first side of the ground leadframe and a lossy layer on a second side of the ground leadframe. The lossy layer and the low loss layer substantially enclose a transition portion of the ground contact. The lossy layers are manufactured from lossy material having conductive particles in a dielectric binder material. The lossy layers absorb electrical resonance propagating through the contact module stack.