Contact Modules for Receptacle Assemblies with Ground Shield Bearing Surfaces
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Solution Overview
Problem
Conventional orthogonal midplane connector systems face limitations in contact density and signal integrity due to complex and costly routing of signals through header connectors and midplane circuit boards, often resulting in signal degradation.
Innovation Solution
The proposed solution involves a contact module for a receptacle assembly with a conductive holder and frame assembly that includes receptacle signal contacts arranged in differential pairs, a ground shield for electrical shielding, and a jogged section to facilitate mounting and force transfer, enhancing contact density and signal integrity without the need for complex trace routing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional orthogonal connectors are used with 90° rotation in the midplane assembly, then the connector system can be assembled, but the contact density is limited and signal degradation occurs due to complex routing
Solution Approach 1:
The patent inverts the conventional approach by eliminating the 90° rotation in the midplane assembly. Instead of rotating headers to achieve orthogonal connections, the invention uses ground shields with jogged sections that bend out of plane to provide mechanical coupling and force transfer, allowing signal paths to remain straight through the midplane, thereby improving signal integrity while reducing routing complexity
Solution Approach 2:
The invention segments the connector system into modular components: receptacle assemblies with ground shields, conductive holders, and frame assemblies. Each ground shield is a separate component with a jogged section that can be independently manufactured and assembled, allowing for simplified routing while maintaining assembly capability
2Quantity of substance
If conventional contact and via patterns are used in orthogonal connectors, then the connector can be manufactured, but the contact density remains limited
Solution Approach 1:
The invention adds a third dimension to the contact arrangement by using ground shields that extend beyond the plane of the circuit board. The jogged sections of the ground shields bend out of plane, creating additional spatial dimensions for contact placement. This allows contacts to be arranged in multiple layers and orientations, significantly increasing contact density without complicating the manufacturing process
3Strength
If ground pins are directly mounted to the circuit board without bearing surfaces, then the assembly is simple, but forces during coupling cannot be properly transferred
Solution Approach 1:
The invention incorporates bearing surfaces on the ground shields during the manufacturing process, before assembly. These bearing surfaces are pre-formed on the jogged sections of the ground shields, positioning them to receive and distribute coupling forces. This preliminary preparation ensures that when the connector is assembled and coupled to the circuit board, forces are properly transferred through the ground pins via the bearing surfaces, enhancing strength without adding complex assembly steps
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves higher contact density and improved signal integrity by simplifying the connector system, reducing manufacturing complexity and costs, while maintaining performance by eliminating the need for 90° rotation and complex trace routing.
Implementation Method 1
A frame assembly is received in the conductive holder and is electrically shielded by the conductive holder
Implementation Method 2
The bearing surfaces engage at least one of the conductive holder and the frame assembly to transfer the forces between the ground shield and at least one of the conductive holder and the frame assembly
Data Source
AI summary
A contact module includes a conductive holder and a frame assembly received in the conductive holder with receptacle signal contacts arranged in differential pairs. A ground shield is received in the conductive holder between the frame assembly and the conductive holder. The ground shield has a mounting end with ground pins extending from a mounting edge at the mounting end of the ground shield. Forces are imparted on the ground pins during coupling with a circuit board. The mounting end has a plurality of bearing surfaces proximate to the ground pins. The bearing surfaces engage at least one of the conductive holder and the frame assembly to transfer the forces between the ground shield and at least one of the conductive holder and the frame assembly.