Contact Pad Segregation Suppression for Corrosion Resistance
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Metal alloys used in electronic components are susceptible to pitting corrosion, which can be exacerbated by artificial passivation methods that obstruct electrical contact and potentially induce galvanic corrosion, while conventional methods to reduce corrosion either weaken electrical contacts or increase the risk of corrosion.
Innovation Solution
A method involving the formation of a contact pad with a self-segregating composition and a segregation suppression structure featuring nucleation inducing topography features to perturb chemical segregation, thereby reducing pitting corrosion by refining the microstructure and preventing galvanic coupling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If artificial passivation is applied to reduce pitting corrosion, then corrosion resistance is improved, but electrical contact capability deteriorates
Solution Approach 1:
The contact pad is divided into multiple crystallites with different orientations, creating internal boundaries that segment the material structure. This segmentation prevents uniform chemical segregation and reduces galvanic coupling while maintaining electrical conductivity through the distributed crystallite structure.
Solution Approach 2:
The contact pad employs a self-segregating composition where different regions have different crystallographic orientations and local compositions. This local variation in properties prevents uniform corrosion pathways while maintaining overall electrical functionality through the heterogeneous structure.
2Ease of operation
If dry etching is used to remove artificial passivation for electrical contact, then electrical contact capability is improved, but pitting corrosion risk increases
Solution Approach 1:
The contact pad is pre-formed with a self-segregating composition and controlled crystallite structure before electrical contact is established. This preliminary structuring ensures corrosion resistance is built-in from the start, eliminating the need for subsequent passivation removal and avoiding the associated corrosion risks.
3Ease of operation
If bonding parameters are adapted for bonding through artificial passivation, then electrical contact capability is improved, but contact strength deteriorates
Solution Approach 1:
The contact pad's segmented crystallite structure provides multiple bonding interfaces and load distribution pathways, enhancing overall contact strength while maintaining electrical capability through the distributed conductive network.
4Reliability
If artificial passivation including metal is used to reduce corrosion, then corrosion resistance is improved, but galvanic corrosion is induced
Solution Approach 1:
The contact pad uses a self-segregating composition of the same metal alloy throughout, creating a homogeneous material system that eliminates galvanic potential differences. The uniform composition prevents galvanic corrosion while the controlled crystallite structure provides corrosion resistance without requiring additional metal passivation layers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively reduces pitting corrosion and galvanic corrosion, ensuring stable electrical contacts by spatially limiting compositional variations and preventing galvanic interactions, thus enhancing the durability and reliability of electronic components.
Implementation Method 1
perturbing a chemical segregation of the self-segregating composition by crystallographic interfaces of the contact pad defined by the nucleation inducing topography features
Implementation Method 2
the segregation suppression structure includes more nucleation inducing topography features than the at least one electrically conductive contact region
Data Source
AI summary
According to various embodiments an electronic component includes: at least one electrically conductive contact region; a contact pad including a self-segregating composition disposed over the at least one electrically conductive contact region; a segregation suppression structure disposed between the contact pad and the at least one electrically conductive contact region, wherein the segregation suppression structure includes more nucleation inducing topography features than the at least one electrically conductive contact region for perturbing a chemical segregation of the self-segregating composition by crystallographic interfaces of the contact pad defined by the nucleation inducing topography features.