Contact Pin Alignment Using Bottom-Plate Self-Combing Assembly
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Solution Overview
Problem
Existing IC device testing apparatus face challenges in aligning rows of contact pins, particularly Kelvin contacts, which are cumbersome and time-consuming due to the need for additional alignment tools and spacers.
Innovation Solution
The method utilizes structures in the bottom plates of the assembly to align contact pins, using slits and cutouts with chamfered edges to guide and secure the pins into alignment without additional tools, applicable to both double and single rows of contact pins.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional alignment tools and spacers are used to align contact pins, then alignment precision is improved, but device complexity and assembly time increase
Solution Approach 1:
The patent merges the alignment function into the bottom plate structure itself by incorporating guide slots and positioning features directly into the bottom plate. This eliminates the need for separate alignment tools and spacers, reducing device complexity while maintaining alignment precision through integrated structural guidance.
Solution Approach 2:
The bottom plate structure provides self-alignment capabilities through its integrated guide slots and positioning features. The contact pins automatically align themselves as they are inserted into the bottom plate, eliminating the need for external alignment tools and reducing assembly complexity.
2Manufacturing precision
If traditional alignment tools and spacers are used to align contact pins, then alignment precision is improved, but assembly time increases
Solution Approach 1:
The alignment function is merged into the bottom plate structure through integrated guide slots and positioning features. This allows alignment to occur automatically during the insertion process itself, eliminating the need for separate alignment steps and significantly reducing assembly time while maintaining precision.
Solution Approach 2:
The bottom plate is pre-configured with guide slots and positioning features that prepare the alignment path in advance. Contact pins are guided into their correct positions as they are inserted, performing the alignment action preliminarily during insertion rather than requiring a separate post-insertion alignment step.
3Manufacturing precision
If traditional alignment tools and spacers are used to align contact pins, then alignment precision is improved, but material usage increases
Solution Approach 1:
The alignment function is merged into the bottom plate structure itself, eliminating the need for separate alignment tools and spacers. This integration reduces material consumption by removing redundant components while maintaining alignment precision through the bottom plate's built-in guide slots and positioning features.
Solution Approach 2:
The patent extracts the alignment function from separate external tools and spacers and incorporates it directly into the bottom plate structure. This eliminates the need for additional alignment materials and tools, reducing overall material usage while preserving alignment precision.
Data Source
AI summary
A method of aligning one or more rows of contact pins in an integrated circuit (IC) device testing apparatus that uses structures in bottom plates of the assembly itself to align rows of contact pins. Once a row of contact pins has been inserted into slots located on a socket body in the y-axis, one of the bottom plates is lowered onto the socket body. Some structures on the bottom plate restrict it to movement primarily in the x-axis with respect to the socket body, while other structures allow it to capture all misaligned contact pins and “comb” them into alignment by small adjustments in the x-axis. In this way, the rows of contact pins are aligned as part of the assembly process itself, and no additional tools or equipment are needed.