Contact Release Capsule for CMP Slurry Corrosion Control
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Solution Overview
Problem
Current copper Chemical Mechanical Planarization (CMP) slurry technologies face challenges in controlling the exposure of complexing agents, leading to static etching and corrosion of the wafer surface, which affects processing efficiency and tolerances, especially when trying to scale down semiconductor device sizes using existing chip designs.
Innovation Solution
The development of a contact release capsule comprising a particle with a chemical payload and a polymer coating, where the particle is impregnated with a complexing agent like glycine, allowing localized and simultaneous mechanical and chemical action on the wafer surface by releasing the payload upon contact, thereby reducing unwanted corrosion and improving processing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If complexing agents are added to CMP slurry to maintain adequate material removal rate, then productivity is improved, but object-generated harmful factors worsen due to static etching and corrosion of the wafer surface
Solution Approach 1:
The slurry system is segmented into multiple functional components: abrasive particles for mechanical removal, complexing agents for chemical action, and corrosion inhibitors for protection. This segmentation allows each component to perform its specific function optimally, with the corrosion inhibitor counteracting the harmful effects of the complexing agent while the abrasive maintains material removal rate.
Solution Approach 2:
A corrosion inhibitor acts as an intermediary substance that mediates between the complexing agent and the wafer surface. The inhibitor forms a protective layer or reacts with metal ions to prevent unwanted static etching and corrosion, allowing the complexing agent to maintain adequate material removal rate without causing harmful side effects.
2Productivity
If complexing agent exposure is increased to improve material removal, then productivity is improved, but manufacturing precision worsens due to reduced processing tolerances
Solution Approach 1:
The corrosion inhibitor serves as an intermediary that enables higher complexing agent exposure for improved material removal while maintaining processing tolerances. By preventing excessive chemical attack, the inhibitor allows the system to operate at higher productivity levels without sacrificing manufacturing precision.
Solution Approach 2:
The system optimizes the concentration and type of corrosion inhibitor to change the chemical parameters of the slurry, allowing for higher complexing agent levels that improve material removal rate while maintaining adequate processing tolerances through controlled chemical activity.
3Object-generated harmful factors
If additional chemical additives are used to control corrosion, then object-generated harmful factors are reduced, but device complexity increases
Solution Approach 1:
The corrosion inhibitor is selected to perform multiple functions simultaneously: it prevents static etching and corrosion, maintains slurry stability, and does not interfere with the material removal process. This multi-functionality reduces the need for additional specialized additives, thereby controlling device complexity while effectively managing corrosion.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances planarization efficiency, reduces surface dissolution, eliminates the need for additional chemical additives, and stabilizes particle dispersion, leading to improved processing tolerances and reduced costs in CMP processes.
Implementation Method 1
the chemical payload is held inside the particle by the polymer coating
Implementation Method 2
a shearing force removes the polymer coating allowing the chemical payload to release
Implementation Method 3
The CMP process consists of a polishing pad and an aqueous slurry containing chemicals and abrasive nanoparticles
Implementation Method 4
The synergistic combination of mechanical abrasion and chemical etching creates high material removal rates
Data Source
AI summary
The invention relates to a contact release capsule comprising a particle, a chemical payload, and a polymer coating, wherein the particle is impregnated with the chemical payload, and the chemical payload is held inside the particle by the polymer coating until the contact release capsule contacts a surface and a shearing force removes the polymer coating allowing the chemical payload to release outside the particle. The contact release capsule is useful in chemical mechanical planarization slurries. Particularly, the contact release capsule may comprise a glycine impregnated silica nanoparticle coated with a polymer, wherein the contact release capsule is dispersed in an aqueous solution and used in the copper chemical mechanical planarization process. Use of the contact release capsule in a slurry for copper chemical mechanical planarization may significantly improve planarization efficiency, decrease unwanted etching and corrosion, and improve dispersion stability.