Substrate Contact Sealing for Uniform Plating and Seed Layer Protection
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Solution Overview
Problem
Plating processes on substrates can lead to plating failures due to air bubbles in pattern openings, non-uniform plating thickness, and seed layer deterioration caused by incomplete drying or wetness of contact areas, which are not adequately addressed by existing substrate holding structures.
Innovation Solution
A plating method involving a substrate holder that forms a sealed space to protect contact locations from the plating solution, using a conductive liquid to cover the contact area and maintain a controlled electric conductivity, thereby preventing air bubbles and seed layer dissolution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the contact area of the substrate is dried before plating, then the plating solution can be properly applied, but air bubbles remain inside the peripheral openings of the pattern causing plating failures
Solution Approach 1:
The substrate is subjected to a pre-wet process before plating, where the peripheral openings of the pattern are filled with liquid in advance. This preliminary action ensures that when plating occurs, the liquid remains in the openings and prevents air bubbles from forming, thereby eliminating plating failures without requiring complete drying of the contact area.
2Manufacturing precision
If the contact area is completely dried after cleaning, then the seed layer is protected from dissolution, but the plating process may cause non-uniform thickness due to variations in electric supply
Solution Approach 1:
The substrate is held in a state where the contact area maintains a specific level of wetness while other areas are dried. This local quality differentiation ensures that the contact area retains sufficient liquid to maintain consistent electric conductivity and uniform electric supply, while other areas are dried to prevent plating solution leakage and ensure uniform plating film thickness.
Solution Approach 2:
The degree of wetness of the contact area is controlled within a specific range rather than being completely dry or completely wet. By optimizing this parameter, the invention achieves both protection of the seed layer from dissolution and maintenance of consistent electric supply for uniform plating thickness.
3Reliability
If cleaning liquid remains on the contact after cleaning, then the contact is protected from dirt, but the seed layer may be dissolved due to incomplete drying
Solution Approach 1:
A liquid is supplied to the contact area before or during the plating process as a preliminary action. This liquid displaces the cleaning liquid that remains on the contact, preventing the cleaning liquid from contacting and dissolving the seed layer, while still maintaining the contact in a clean state.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method ensures uniform plating thickness and prevents seed layer oxidation, reducing plating failures by maintaining consistent electric supply and minimizing contact exposure to the plating solution.
Implementation Method 1
a contact location between the substrate and the contact is locally covered with a liquid in the sealed space... performing a plating process of the substrate with supplying electric current between the substrate and the anode, in a state that the contact location between the substrate and the contact is covered with a liquid
Implementation Method 2
a sealed space is formed to protect a contact provided to supply electricity to the substrate, from a plating solution
Data Source
AI summary
One object of the present disclosure is to provide a technique of suppressing deterioration of a seed layer of a substrate. There is provided a method of plating, comprising: a process of holding a substrate by a substrate holder, such that a sealed space is formed to protect a contact provided to supply electricity to the substrate, from a plating solution while the substrate holder holds the substrate, and that a contact location between the substrate and the contact is locally covered with a liquid in the sealed space; a process of soaking the substrate held by the substrate holder in the plating solution and placing the substrate to be opposed to an anode; and a process of performing a plating process of the substrate with supplying electric current between the substrate and the anode, in a state that the contact location between the substrate and the contact is covered with a liquid.