Contact Sensor Analysis for PCB Component Push-In Failures
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Solution Overview
Problem
Conventional methods for inspecting component mounting on a board cannot accurately determine if the component is properly pushed into the board, making it difficult to diagnose mounting failures and analyze the component mounting device effectively.
Innovation Solution
An analysis device that includes a contact detection sensor to detect when a component is pushed into the board, storing and outputting detection result data in association with mounting conditions such as holder, pickup slot, component type, and Z-axis usage, allowing for easy analysis of the mounting state and identification of failure causes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If imaging device inspection method is used to check component mounting, then the fact that component is mounted on board can be inspected, but whether the component is pushed into the board with proper load cannot be inspected
Solution Approach 1:
A contact detection sensor is introduced as an intermediary device between the component mounting process and the inspection system. This sensor detects whether the component is properly pushed into the board by sensing contact force or position, providing load detection capability that bridges the gap between visual inspection and mechanical verification.
Solution Approach 2:
The patent replaces purely optical/image-based inspection with a sensor-based detection system that uses mechanical contact sensing. The contact detection sensor directly measures the physical state of component mounting (whether properly pushed in) rather than relying on image analysis, thereby achieving accurate load detection.
2Loss of information
If imaging device inspection method is used, then mounting presence can be detected, but mounting failure cause analysis becomes difficult
Solution Approach 1:
The contact detection sensor provides immediate feedback on component mounting status by detecting whether the component is properly pushed into the board. This feedback mechanism enables real-time identification of mounting failures and their causes, such as improper component insertion or board receptacle issues, without requiring complex analysis systems.
3Measurement precision
If contact detection sensor is added to detect component push-in status, then mounting state analysis accuracy is improved, but device complexity increases
Solution Approach 1:
The contact detection sensor is designed to serve multiple functions: detecting component push-in status, identifying mounting failures, providing diagnostic information, and enabling quality control. By making the sensor multi-functional, the patent avoids adding separate dedicated devices for each function, thereby limiting the increase in overall system complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate analysis of the mounting state and identification of failure causes, improving component mounting quality by providing detailed data on touch detection rates and non-detection rates for each component mounting device.
Implementation Method 1
a contact detection sensor configured to detect that the component picked up by the pickup member is brought into contact with the board
Data Source
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AI summary
An analysis device is a device for use for a component mounting device including a pickup member configured to be moved relative to a board by means of a moving device and a contact detection sensor configured to detect that a component picked up by the pickup member is brought into contact with the board to analyze a mounting state of the component mounting device. The analysis device includes a storage device configured to store multiple detection result data relating to detection results obtained by the contact detection sensor when the component is mounted on the board in association with mounting conditions when the detection results are obtained by the contact detection sensor, and an output device configured to count the multiple detection result data stored in the storage device by at least two conditions in the mounting conditions and output the multiple detection result data so counted.