Power Semiconductor Module Contact Spring Housing Recess
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Solution Overview
Problem
Existing power semiconductor modules face challenges in securing connection elements against falling out and ensuring easy manufacturing processes.
Innovation Solution
The power semiconductor module incorporates contact springs with a pin-like first contact device, a resilient section, and a second contact device, featuring recesses in the housing that accommodate these elements, ensuring they cannot fall out due to a deformation mechanism that fits securely between the recesses and the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If connection elements are designed as contact springs with pin-like contact devices, then electrical contact reliability is improved, but the risk of elements falling out increases
Solution Approach 1:
The pin-like first contact device is nested within the housing structure through recesses. The deformation of the contact device is arranged between the second partial recess and the substrate, creating a nested configuration where the contact element is contained within the housing while maintaining electrical contact functionality.
Solution Approach 2:
The recesses in the housing act as intermediary structures between the contact springs and the external environment. These recesses provide a secure interface that holds the contact elements in place while allowing them to perform their electrical contact function, preventing both falling out and maintaining reliability.
2Stability of the object's composition
If recesses with specific diameter constraints are used to secure contact springs, then connection element retention is improved, but manufacturing complexity increases
Solution Approach 1:
The housing recesses are segmented into first and second partial recesses with different functional requirements. The first partial recess accommodates the contact spring from the outside, while the second partial recess secures the deformation between the contact device and substrate. This segmentation allows each portion to be optimized independently for its specific function.
Solution Approach 2:
Different portions of the housing structure have different local qualities - the first partial recess has a larger diameter for accommodating the contact spring, while the second partial recess has a smaller diameter for securing the deformation. This local differentiation of structural properties allows the housing to perform multiple functions with a unified design approach.
3Stability of the object's composition
If contact springs are secured between recesses and substrate through deformation, then connection element retention is improved, but manufacturing precision requirements increase
Solution Approach 1:
The recesses are pre-formed in the housing with specific dimensional relationships established during manufacturing. The first and second partial recesses are created with predetermined diameter ratios and positions, allowing the contact springs to be subsequently installed and deformed into their securing position without requiring high-precision post-processing.
Solution Approach 2:
The design utilizes parameter relationships - specifically the diameter ratio between the first and second partial recesses - to define the securing mechanism. By establishing appropriate parameter ranges and relationships during design, the manufacturing process can accommodate normal tolerances while still achieving reliable retention of the contact elements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design secures connection elements effectively and simplifies the manufacturing process by preventing accidental dislodgment, ensuring reliable and stable electrical contacts.
Implementation Method 1
an elastic cushion element for storing pressure
Implementation Method 2
The substrate is pressed onto a cooling component by means of such a pressure device, and the heat transfer between the substrate and the cooling component is thus permanently and reliably established
Data Source
Figure 1
Figure 2~3
Figure 4~5
AI summary
The invention describes a power semiconductor module comprising a housing, a substrate, and at least one metallic conductor track. Connecting elements extend outwards from a conductor track or a contact surface of a power semiconductor device arranged on a conductor track, with at least one connecting element being designed as a contact spring. This contact spring has a first contact element, a resilient section, and a second contact element. The housing has recesses with a first and a second partial recess for arranging the contact spring. The first contact element of the contact spring is pin-shaped, and the diameter of the second partial recess is smaller than the sum of the diameter of the pin-shaped first contact element and the deflection determined by deformation of this first contact element.Furthermore, the deformation is arranged between the second partial recess and the substrate.