Contactless Communication Medium Sealing Member Design
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Solution Overview
Problem
Conventional contactless communication media with exposed IC modules are prone to malfunctions and communication disorders due to external impacts, especially when the IC module is not adequately protected.
Innovation Solution
A contactless communication medium design featuring a first substrate with an opening to expose the IC module's mold part, a second substrate with a recessed area to accommodate the mold part, and a sealing member with an insulating and adhesive layer to cover the mold part, ensuring the sealing member does not contact the second substrate in directions parallel to the mold part's sides, thereby reducing external influences.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the IC module is exposed from an opening in the substrate to allow external access, then the ease of operation is improved, but the reliability deteriorates due to vulnerability to external impacts and electricity
Solution Approach 1:
A sealing member in the form of a thin film structure is introduced to cover the exposed IC module. The sealing member has an insulating layer and an adhesive layer stacked together, forming a protective barrier that shields the IC module from external impacts and electrical interference while maintaining a relatively thin profile that does not significantly increase the overall thickness of the contactless communication medium.
Solution Approach 2:
The sealing member acts as an intermediary element between the external environment and the IC module. It provides insulation and mechanical protection without directly exposing the IC module to harmful external factors, thus mediating the interaction between the external world and the sensitive electronic components.
2Reliability
If a sealing member is added to protect the IC module from external impacts, then the reliability is improved, but the device complexity increases due to additional layers and components
Solution Approach 1:
Multiple functions are merged into a single sealing member component. The sealing member simultaneously provides mechanical protection against impacts, electrical insulation to prevent interference, and adhesive bonding to secure the IC module to the substrate. This consolidation reduces the number of separate components needed while achieving comprehensive protection.
Solution Approach 2:
The sealing member is constructed as a composite structure with an insulating layer and an adhesive layer stacked together. This composite material approach allows the sealing member to exhibit multiple properties (insulation, adhesion, mechanical strength) that would be difficult to achieve with a single material, thereby providing reliable protection without requiring numerous separate layers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively reduces the impact of external factors on the IC module, minimizing malfunctions and communication disorders while maintaining a flat outer surface and preventing cracks during line pressure tests.
Implementation Method 1
a adhesive layer, and a sealing member having an insulating layer and the adhesive layer in a stacked manner is located so as to cover the mold part, the sealing member being bonded to the mold part via the adhesive layer
Data Source
AI summary
Even when a mold part of an IC module is exposed from an opening provided in a substrate of an inlay, occurrence of malfunction, communication disorders or the like of the IC module due to the influence of an external impact or the like is prevented. By combining a sealing member including an insulating layer and an adhesive layer in a stacked manner to a shape covering a mold part of the IC module, occurrence of malfunction, communication disorders or the like of the IC module is prevented even if there is an influence of an external impact or the like. Meanwhile, by providing a sealing member, concentration of stress on the mold part in a line pressure test is alleviated by limiting the size of the sealing member, and also occurrence of cracks in the mold part can be prevented.