Contactless PCB Probe Mapping for Visual EMI Source Detection
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for locating electromagnetic interference (EMI) sources on printed circuit boards (PCBs) are cumbersome and require manual comparison of measured values at multiple positions, making them time-consuming and inefficient.
Innovation Solution
A method and system that uses a contactless probe to measure electromagnetic parameters at multiple PCB positions, correlating these measurements with images captured by a camera fixed to the probe, and superimposing the data onto a map representation of the PCB to visualize EMI sources.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If manual measurement and comparison methods are used to locate EMI sources on PCB, then measurement capability is achieved, but time consumption and operational complexity increase significantly
Solution Approach 1:
The patent creates a visual copy (image) of the PCB area and superimposes measurement values onto this copy. The image serves as a visual representation that can be displayed and analyzed without physically moving the probe between multiple positions, thereby reducing time consumption while maintaining measurement accuracy.
Solution Approach 2:
The patent transitions from one-dimensional numerical data (measurement values) to two-dimensional visual representation (image with superimposed values). By displaying measurement values directly on the PCB image at their corresponding positions, the system enables spatial visualization of EMI sources, making location identification more efficient and accurate.
2Loss of information
If multiple measurement positions are surveyed to identify EMI sources, then comprehensive data is obtained, but operational complexity and difficulty of data comparison increase
Solution Approach 1:
The patent merges multiple measurement data points with their corresponding spatial positions on the PCB into a single visual representation. By superimposing all measurement values onto one PCB image with position markers, the system combines comprehensive measurement data with spatial context, enabling easy visual comparison without manually handling multiple separate measurements.
3Manufacturing precision
If probe positioning precision is improved to locate miniaturized circuits, then measurement accuracy increases, but positioning difficulty and device complexity increase
Solution Approach 1:
The patent introduces an image as an intermediary between the probe and the PCB. Instead of directly manipulating the physical probe position, the system captures an image of the PCB area and displays measurement values on the image. This intermediary visual representation simplifies the positioning task by providing clear visual feedback without requiring complex positioning mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Provides a simplified and efficient way to identify EMI sources by overlaying measured values directly onto a visual representation of the PCB, offering a clear overview of critical sections and facilitating easy documentation.
Implementation Method 1
a probe head of the probe contactless measures values of at least one electromagnetic parameter at at least two different positions of the PCB
Implementation Method 2
a camera fixed in position relative to the probe head records for each of the different positions an image of an area of the PCB around the probe head
Data Source
AI summary
Method, system and probe for visualizing measured values of an electromagnetic parameter of a PCB. A probe head of a probe contactless measures values of at least one electromagnetic parameter at at least two different positions of the PCB, a camera fixed in position relative to the probe head records for each of the different positions an image of an area of the PCB around the probe head, for each of the different positions, the measured value of the electromagnetic parameter is correlated with the recorded image of the area of the PCB around the probe head, a location of each of the recorded images of the areas on a map representation of the PCB is determined, the map representation of the PCB with the measured values of the electromagnetic parameter, and the map representation of the PCB is visualized together with the superimposed measured values of the electromagnetic parameter.


