Removable Contactless Probe for High-Speed PCB Signal Integrity
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Solution Overview
Problem
Traditional signal integrity measurement techniques are inadequate for high-speed signals as they compromise signal quality and are time-consuming, risking damage to printed circuit boards due to direct soldering.
Innovation Solution
A contactless probe system that measures signal integrity by using a microstrip with a conductive structure and probe leads communicating with clamps, allowing for non-invasive, accurate measurement of electromagnetic fields close to the surface without physical contact, utilizing additive manufacturing for optimal production.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If traditional soldering techniques are used to attach probe tips to PCB traces, then measurement capability is achieved, but signal integrity is compromised and risk of PCB damage increases
Solution Approach 1:
The patent introduces an intermediary conductive structure (loop or coplanar waveguide) that couples electromagnetically to the signal trace without direct physical contact. This intermediary acts as a mediator that transfers signal information to the probe while isolating the measurement device from the trace, thereby maintaining signal integrity and eliminating soldering-related damage risks
Solution Approach 2:
The patent replaces the mechanical soldering connection system with an electromagnetic coupling system. Instead of physically attaching probe tips to PCB traces through soldering, the system uses electromagnetic fields to couple the conductive structure to the signal trace, enabling contactless measurement that preserves signal quality
2Adaptability or versatility
If probe tips are directly soldered to PCB traces for measurement, then measurement location flexibility is achieved, but measurement time increases and PCB damage risk increases
Solution Approach 1:
The conductive structure serves as a removable intermediary that can be attached and detached from different measurement locations. This intermediary enables rapid repositioning between traces without requiring soldering operations, significantly reducing measurement preparation time while maintaining location flexibility
Solution Approach 2:
The measurement system transitions from a static soldered connection to a dynamic removable attachment. The conductive structure can be quickly connected and disconnected at various PCB locations, enabling adaptive measurement positioning without the time-consuming soldering process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables fast, minimally invasive measurement of signal integrity with reduced risk of damage, preserving signal quality and hardware, suitable for high-speed applications up to 32 gigabits per second, and allowing for flexible measurement locations without soldering.
Implementation Method 1
A contactless probe system that measures signal integrity by using a microstrip with a conductive structure and probe leads communicating with clamps, allowing for non-invasive, accurate measurement of electromagnetic fields close to the surface
Data Source
AI summary
A system may include a printed circuit board with a microstrip and a conductive structure surrounding the microstrip. The system may include a probe lead in communication with the conductive structure. The system may include a first contact pad electrically connected to the conductive structure and a second contact pad electrically connected to the conductive structure.