Contactless Communication Medium with Sealing Member for Static Electricity Prevention
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional contactless communication media face challenges in preventing static electricity invasion to IC modules, which can be exacerbated by the exposure of IC components, and struggle to maintain flatness for passing tests like the ballpoint pen test due to gaps between sealing resin parts and substrates.
Innovation Solution
A contactless communication medium design featuring a first substrate with an opening for the IC module, a sealing member with an insulating and conductive layer stack covering the IC module, and a second substrate with an antenna, where the sealing member fills gaps and ensures a flat outer surface by having a longitudinal elastic modulus smaller than the sealing resin part, preventing static electricity invasion and satisfying flatness criteria.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the substrate opening is made smaller than the sealing resin part to prevent gaps, then static electricity prevention is improved, but the IC module may be destroyed by external force during assembly
Solution Approach 1:
The patent introduces a sealing member as an intermediary component between the substrate opening and the sealing resin part. This sealing member fills the gap without requiring forceful insertion, thereby preventing static electricity invasion while avoiding damage to the IC module. The sealing member acts as a mediator that resolves the conflict between gap prevention and module protection.
Solution Approach 2:
The sealing member is designed with specific local properties: it has a longitudinal elastic modulus smaller than the sealing resin part to allow gentle filling, and its outer surface is made flat to maintain overall surface flatness. These localized quality adjustments enable the sealing member to prevent gaps without transmitting excessive force to the IC module.
2Reliability
If the substrate opening is made larger than the sealing resin part to avoid external force, then IC module safety is improved, but gaps are formed allowing static electricity invasion
Solution Approach 1:
The sealing member serves as a filler intermediary that occupies the space between the substrate opening and the sealing resin part. By positioning this sealing member in the gap region, the patent simultaneously achieves gap closure for static electricity prevention and maintains a relaxed fit that avoids forcing the IC module.
Solution Approach 2:
The sealing member is constructed as a composite structure with an insulating layer and a conductive layer stacked in that order from the IC module side. This composite material design provides both electrical insulation to block static electricity and structural integrity to maintain the seal without requiring excessive compression force.
3Object-affected harmful factors
If a flexible substrate material is used to push the sealing resin part into the opening, then gap prevention is improved, but the IC module may be destroyed by external force
Solution Approach 1:
The sealing member acts as a mediator that eliminates the need for forceful pushing during assembly. By providing a compliant filling material that can be gently pressed into the gap region, the sealing member prevents gaps from forming without transmitting damaging forces to the IC module, thereby resolving the contradiction between gap prevention and module protection.
4Object-affected harmful factors
If the sealing resin part is pushed into the opening, then gap prevention is improved, but the substrate may run on the sealing resin part causing IC module destruction
Solution Approach 1:
The sealing member is designed with specific local mechanical properties, particularly a longitudinal elastic modulus smaller than the sealing resin part. This local quality adjustment allows the sealing member to be compressed into the gap without transmitting excessive force to the IC module, preventing both gaps and substrate running while maintaining module safety.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents static electricity from reaching the IC module and ensures a flat, smooth outer surface, enhancing the reliability and performance of the contactless communication medium by maintaining communication response integrity under various tests, including static electricity, ballpoint pen, and stamp tests.
Implementation Method 1
a conductive layer provided in a stacked manner with an insulating layer and having a shape covering the IC module, in which the insulating layer is on the IC module side
Data Source
AI summary
A contactless communication medium which can prevent invasion of static electricity and has an outer surface which can satisfy requirements on the flatness thereof. The contactless communication medium has a sealing member including an insulating layer and a conductive layer provided in a stacked manner and having a shape covering an IC module is located such that the insulating layer is on the IC module side. Owing to this, static electricity coming from outside is diffused by the conductive layer and blocked by the insulating layer. Thus, adverse influence of the static electricity on the IC module is prevented. The contactless communication medium can also satisfy the requirements on the flatness of an outer surface thereof.