Contactless Sensing Current Layout for Compact Semiconductor Modules
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Solution Overview
Problem
The size of semiconductor devices is increased due to the need for a large current sensing coil to sense the main current, which is disposed around the main current path.
Innovation Solution
A semiconductor device that includes a first semiconductor element through which a main current flows, a second semiconductor element with a sensing current correlated to the main current, and a current sensor that senses the sensing current in a contactless manner, allowing for miniaturization of the current sensor and the device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a current sensing coil is disposed around a main current path to sense the main current, then current sensing is achieved, but the size of the semiconductor device increases
Solution Approach 1:
The patent divides the current sensing function into two parts: a sensing current path that carries a scaled-down version of the main current, and a separate sensing coil. This segmentation allows the sensing coil to be much smaller while still providing accurate current measurement through the correlated sensing current.
Solution Approach 2:
The patent changes the current parameter by creating a sensing current that is correlated to but smaller than the main current. This parameter transformation allows the sensing coil to operate at lower current levels, reducing its required size while maintaining measurement accuracy through the correlation between sensing and main currents.
2Measurement precision
If a large current sensing coil is used to sense main current, then sensing accuracy is maintained, but the complexity of device structure increases
Solution Approach 1:
The patent segments the current path into a main current path and a sensing current path, allowing the sensing coil to be positioned around the smaller sensing current path rather than the large main current path. This reduces structural complexity while maintaining sensing capability.
Solution Approach 2:
The sensing current acts as an intermediary between the main current and the sensing coil. Instead of directly sensing the large main current, the system uses the correlated sensing current as a mediator, simplifying the overall structure and reducing the requirements for the sensing coil.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The contactless sensing of the sensing current enables a smaller current sensor and reduces the overall size of the semiconductor device while maintaining accurate current sensing.
Implementation Method 1
a current sensor sensing the sensing current in a contactless manner
Data Source
AI summary
The object is to provide a technology for enabling reduction in the size of a semiconductor device. The semiconductor device includes a first semiconductor element and a second semiconductor element. An output of the first semiconductor element is connected to an output of the second semiconductor element through wiring. A main current flows through the first semiconductor element, and a sensing current flows through the second semiconductor element. The sensing current has a correlation with the main current. The semiconductor device further includes a current sensor. The current sensor senses the sensing current flowing through the second semiconductor element in a contactless manner.