Contactless Sensor Package for Direct Junction Temperature Sensing
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Solution Overview
Problem
Current semiconductor device products lack accurate and direct temperature measurement capabilities due to internal temperature sensors providing only general and inaccurate readings, contributing to larger and more complex products.
Innovation Solution
Implementing a device package with a sensor receptacle and sensor positioned externally, such as in a trench or molding, to directly measure device junction temperature without contact, using sensors like IR thermopile or thermocouples, allowing for precise and cost-effective temperature sensing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If internal temperature sensors are installed in semiconductor devices, then temperature measurement capability is provided, but product size increases and measurement accuracy deteriorates due to indirect measurement
Solution Approach 1:
The sensor is extracted from the internal structure and relocated to an external position on the device package surface. This allows direct measurement of device temperature without occupying internal space, thereby improving measurement accuracy while maintaining compact product size.
Solution Approach 2:
A sensor receptacle structure serves as an intermediary between the device and the external sensor. This receptacle provides a dedicated mounting location that enables direct thermal coupling or proximity sensing, achieving accurate temperature measurement without internal sensor installation.
2Measurement precision
If internal temperature sensors are installed, then temperature measurement is enabled, but device complexity increases
Solution Approach 1:
The temperature sensing function is extracted from the device internal structure and implemented externally. This separation simplifies the device architecture by eliminating the need for internal sensor integration while maintaining the measurement capability through the external sensor positioned in the sensor receptacle.
Solution Approach 2:
The sensor receptacle structure serves multiple functions: it provides mechanical support for the external sensor, establishes thermal coupling or proximity for accurate measurement, and maintains a compact form factor. This multi-functionality reduces overall device complexity compared to dedicated internal sensor implementations.
3Adaptability or versatility
If sensors are located in adjoining structures, then general measurement is enabled, but direct device property measurement accuracy deteriorates
Solution Approach 1:
The sensor receptacle is positioned at a specific location on the device package surface that provides optimal thermal coupling or proximity to the device being measured. This localized positioning ensures accurate direct measurement of device properties while maintaining placement flexibility through the external configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise and faster temperature measurement externally, reducing product size and cost while improving design flexibility and noise immunity, eliminating the need for internal sensors.
Implementation Method 1
using sensors like IR thermopile or thermocouples
Implementation Method 2
using sensors like IR thermopile or thermocouples
Data Source
AI summary
A device package includes an assembly that includes an assembly top surface; signal contacts arranged in and/or on the assembly; power contacts arranged in and/or on the assembly; at least one power device; at least one sensor receptacle; and at least one sensor arranged in the at least one sensor receptacle.