Contactless Substrate Transport Hand for Thin Wafer Bending
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Solution Overview
Problem
Current substrate transport devices face difficulties in transporting thinner and larger-diameter substrates due to increased bending issues, which can lead to unsuitable handling and potential damage.
Innovation Solution
A substrate treating apparatus with a first transport mechanism featuring a hand with a suction portion that flows gas along the substrate's top face to suck it upward without contact, and receivers to catch the substrate if it falls, ensuring secure transportation and placement on a mount table or substrate holder.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a conventional substrate transport device is used, then it can transport standard substrates, but it cannot suitably transport thinner and larger-diameter substrates due to increased bending amounts
Solution Approach 1:
The transport device is divided into multiple independent suction units arranged in an array, allowing each unit to independently support different regions of the substrate. This segmentation enables the device to adapt to various substrate sizes and shapes while maintaining reliable transport through distributed support points that prevent bending.
Solution Approach 2:
The array of suction units is designed to handle multiple types of substrates (different sizes, shapes, and thicknesses) using the same basic mechanism. The universal design allows the transport device to accommodate both standard and non-standard substrates without requiring different transport mechanisms, thereby improving adaptability while maintaining transport reliability through consistent suction-based handling.
2Ease of operation
If a suction device is used to hold the substrate, then it can transport the substrate without contact, but it may not provide sufficient support for thinner substrates with larger bending amounts
Solution Approach 1:
Instead of using a single suction device, the invention employs multiple suction units arranged in an array across the substrate surface. This segmentation distributes the support load across multiple points, preventing excessive bending of thin substrates while maintaining contactless handling. Each suction unit independently contributes to overall substrate stability.
Solution Approach 2:
The invention replaces traditional mechanical contact-based support (clamps, holders, or direct physical contact) with a suction-based system. This substitution allows for contactless handling that still provides sufficient support force through vacuum pressure, enabling reliable transport of thin substrates without the need for mechanical contact that could cause damage or bending.
3Force
If high pressure air is supplied to the suction device, then it can strongly hold the substrate, but it increases energy consumption and may cause substrate damage
Solution Approach 1:
The suction force is distributed across multiple independent suction units rather than concentrating high pressure in a single device. This allows each unit to operate at lower pressure levels while collectively providing sufficient total suction force to hold the substrate, thereby reducing overall energy consumption and minimizing the risk of substrate damage from excessive localized pressure.
Solution Approach 2:
Instead of applying excessive high pressure to a single suction point, the system uses multiple suction units that collectively provide the necessary holding force. Each unit operates at a moderate pressure level, and the combined effect achieves the required total suction force, avoiding the energy waste and potential damage associated with excessive localized pressure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables reliable and damage-free transportation and placement of substrates, addressing the challenges of handling thinner and larger substrates by using a gas suction mechanism and receivers to prevent drops and ensure proper positioning.
Implementation Method 1
The suction device (171) is in communication with a high pressure air source. The high pressure air source supplies high pressure air to the suction device (171). When the suction device (171) is positioned above a substrate (W), high pressure air flows out from the suction device (171) through a gap between the suction device (171) and an upper face of the substrate (W). This causes the suction device (171) to hold the upper face of the substrate (W).
Data Source
AI summary
Disclosed are a substrate treating apparatus and a substrate transporting method. The substrate treating apparatus includes a first transport mechanism. The first transport mechanism includes a hand. A hand includes a base, a suction portion, a first receiver, a second receiver, and a receiver driving unit. The suction portion is attached to the base. The suction portion flows gas along a top face of a substrate, and sucks the substrate upward without contacting the substrate. The first receiver and the second receiver are supported on the base. The first receiver and the second receiver are disposed below the substrate sucked by the suction portion. The first receiver and the second receiver can receive a back face of the substrate. The receiver driving unit moves the second receiver with respect to the base. The receiver driving unit causes the second receiver to access the first receiver and to move away from the first receiver.