Contactless Board Interconnect Using Waveguide Cavities
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Solution Overview
Problem
Existing board-to-board interconnect systems face issues with constant contact wear and potential separation due to vibrations, leading to concerns about the integrity of electrical connections.
Innovation Solution
A contactless interconnect system using microwave waveguides with conductive gaskets to secure and align the waveguides between circuit boards, eliminating the need for physical contacts and ensuring secure transmission of microwave signals across sealed boundaries.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a multi-contact connector is used for board-to-board interconnection, then electrical connection is established, but contact wear occurs due to repeated connect-disconnect cycles
Solution Approach 1:
The patent replaces the mechanical contact-based connector system with a waveguide-based electromagnetic signal transmission system. Instead of using physical contacts that wear out, the invention uses waveguides to transmit microwave signals between circuit boards, eliminating mechanical contact and its associated wear problems entirely.
Solution Approach 2:
The invention extracts and removes the contact elements from the interconnection system. By eliminating the contacts entirely and using waveguide cavities for signal transmission, the patent removes the source of contact wear and connection integrity issues associated with repeated mating cycles.
2Reliability
If a multi-contact connector is used for board-to-board interconnection, then electrical connection is established, but vibration causes contact separation and connection failure
Solution Approach 1:
The patent replaces the mechanical contact system vulnerable to vibration with a waveguide-based electromagnetic transmission system. The waveguide structure provides a rigid, vibration-resistant pathway for microwave signals, eliminating the contact separation problem that occurs in traditional connectors under vibrational stress.
Solution Approach 2:
The waveguide cavities provide a continuous, curved electromagnetic field pathway that is inherently more resistant to vibration-induced disruption compared to discrete contact points. The enclosed cavity structure maintains signal integrity even when subjected to vibrational forces.
3Reliability
If waveguide cavities are aligned between circuit boards, then signal transmission is achieved, but precise alignment is required
Solution Approach 1:
The patent employs adjustable positioning mechanisms that allow for fine-tuning of the waveguide cavity alignment parameters. By enabling adjustment of position and orientation, the system can compensate for manufacturing tolerances and achieve proper alignment during assembly rather than requiring perfect precision during manufacturing.
Solution Approach 2:
The invention incorporates movable or adjustable waveguide components that can be dynamically positioned to achieve proper alignment. This dynamic adjustment capability allows the system to adapt to slight misalignments and achieve optimal signal transmission without requiring extremely tight manufacturing tolerances.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system provides a reliable and vibration-resistant interconnect solution that maintains signal integrity and prevents microwave energy leakage, enabling efficient data transfer between circuit boards while withstanding harsh environments.
Implementation Method 1
a microwave waveguide extending between the two circuit boards
Implementation Method 2
A first conductive gasket is positioned between the first circuit board and the first end of the first waveguide. The first conductive gasket has an aperture aligned with the first waveguide cavity.
Data Source
Figure 1
Figure 2
Figure 3~4
AI summary
A board to board contactless interconnect system includes a first circuit board for launching at st one microwave signal into a cavity of a first waveguide secured thereto. A second waveguide, secured to a second circuit board, is coupleable to the first waveguide to receive the at least one microwave signal in a cavity of the second waveguide and conduct the at least one microwave signal onto a microwave receiver aligned with the cavity on the second circuit board. The waveguides may be separable and may include additional waveguides. Conductive gaskets with apertures for microwave signals to pass through are positioned between the waveguides and between each circuit board and a waveguide to prevent leakage of microwave energy therebetween. Some embodiments may pass signals through a sealed boundary and maintain integrity of the seal. Such embodiments may have a third waveguide interposed between the first and second waveguides.