Container Heat Dissipation Apparatus with Nested Cooling Cavity
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Solution Overview
Problem
The existing heat dissipation method in data centers housed in containers has a poor heat dissipation effect due to a long gas flow path and increased flow time, which affects the efficiency of the heat dissipation apparatus.
Innovation Solution
A container-based data center with a heat dissipation apparatus that includes a housing with a cooling cavity filled with cooling liquid, an inlet, and an outlet. High-temperature gas enters the cooling cavity through the inlet and is cooled by the liquid, then the low-temperature gas exits through the outlet, creating a heat dissipation circulation that efficiently cools electronic devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a refrigeration device connected to the outside of the container is used for heat dissipation, then the electronic device can be cooled, but the heat dissipation effect is poor due to long gas flow path and increased flow time
Solution Approach 1:
The heat dissipation apparatus is nested inside the container, with the cooling cavity positioned within the accommodating cavity. This nested structure eliminates the need for external refrigeration devices and shortens the gas flow path by placing the cooling function directly within the container interior, thereby reducing gas flow time while maintaining effective cooling.
Solution Approach 2:
A cooling liquid is introduced as an intermediary substance in the cooling cavity. The cooling liquid absorbs heat from the high-temperature gas through heat exchange, converting it to low-temperature gas. This intermediary mechanism enhances heat dissipation efficiency by providing direct thermal coupling between the gas and cooling medium, reducing the time required for heat transfer.
2Device complexity
If the heat dissipation apparatus is placed outside the container, then the structure is simpler, but the gas flow path becomes longer and heat dissipation efficiency decreases
Solution Approach 1:
The heat dissipation apparatus is merged with the container structure by placing the cooling cavity inside the accommodating cavity. This integration combines the cooling function with the existing container structure, eliminating the need for separate external refrigeration devices while shortening the gas flow path and improving heat dissipation efficiency.
Solution Approach 2:
The patent utilizes fluid dynamics principles by introducing a cooling liquid that circulates through the cooling cavity. The liquid absorbs heat from the gas through convection and conduction, efficiently transferring thermal energy. This hydraulic approach enhances heat dissipation efficiency by providing direct thermal contact between the cooling medium and the gas stream.
3Productivity
If the gas flow path is shortened, then the heat dissipation efficiency improves, but the apparatus design becomes more complex
Solution Approach 1:
The heat dissipation apparatus is segmented into distinct functional components: the cooling cavity, the cooling liquid circulation system, and the gas flow channels. This segmentation allows for optimized design of each component to minimize gas flow path length while maintaining manageable structural complexity. The cooling cavity is divided into regions for efficient heat exchange.
Solution Approach 2:
The cooling cavity is designed with three-dimensional heat exchange surfaces and multi-directional gas flow paths. By utilizing vertical and horizontal dimensions for heat transfer, the apparatus achieves short gas flow paths while maintaining effective heat dissipation. The cooling liquid flows through channels in multiple dimensions to maximize contact area with the gas.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly improves the cooling efficiency by shortening the gas flow time and maintaining effective heat dissipation, meeting the demand for high heat dissipation performance.
Implementation Method 1
the cooling cavity is filled with a cooling liquid; high-temperature gas in the accommodating cavity enters the cooling cavity through the inlet; and low-temperature gas in the cooling cavity generated after heat exchange with the cooling liquid enters the accommodating cavity through the outlet
Data Source
AI summary
The present application provides a container and a data center of the container. A box is provided with an accommodating cavity for placing an electronic device, and a heat dissipation pipeline includes a housing with a cooling cavity, where the cooling cavity is filled with cooling liquid, and high-temperature gas in the accommodating cavity enters the cooling cavity through an inlet, and low-temperature gas in the cooling cavity generated after heat exchange with the cooling liquid enters the accommodating cavity through an outlet for cooling the electronic device to form heat dissipation circulation.