Container Data Center Cooling via Coil Heat Exchange

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Solution Overview

Problem

Existing cooling methods in container data centers have poor cooling effects due to a small contact area between the cooling medium and the container space, resulting in inefficient heat exchange.

Innovation Solution

A container data center design featuring a box with an accommodating cavity for electronic devices, a heat dissipation pipeline with a coil component, a supply component, and an extraction component. The coil component is located inside the heat dissipation pipeline and has a large cross-sectional area for enhanced heat exchange, with the cooling medium flowing inside to cool high-temperature gases.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If a cooling medium is directly introduced into the container to exchange heat with high-temperature air, then the cooling system is simple, but the cooling effect is poor due to small contact area

Engineering Contradiction:
Improvecooling system structureVSAvoidcooling effect
Core Design Contradiction:
Device complexityVSTemperature

Solution Approach 1:

The patent transforms the cooling medium from a gas phase to a liquid phase, utilizing the liquid's higher density and better heat transfer properties. The liquid cooling medium flows through pipelines in contact with the container wall, effectively utilizing the three-dimensional space within the container for heat exchange, thereby dramatically improving the contact area and cooling efficiency.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Productivity

If the cooling medium contact area with the container space is increased, then the heat exchange efficiency is improved, but the system complexity increases

Engineering Contradiction:
Improveheat exchange efficiencyVSAvoidcooling system structure
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The cooling system is segmented into distinct functional modules: a cooling medium supply component, a heat dissipation pipeline system with coil components, and an extraction component. This segmentation allows each component to be optimized independently while working together to achieve efficient heat exchange throughout the container space.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent employs a nested structure where coil components are arranged inside the heat dissipation pipelines, and multiple coil components are distributed throughout the container. This nested arrangement maximizes the contact area between the cooling medium and the container wall without requiring a completely separate external cooling system.

Inventive Principle:
Principle #7Nested doll (Nesting)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design improves heat exchange efficiency by increasing the contact area between the cooling medium and the high-temperature gas, effectively cooling electronic devices within the container data center.

Implementation Method 1

the coil component has a cooling medium flowing inside; the cooling medium becomes a defective medium after heat exchange with a high-temperature gas

Methodology Applied
Scientific EffectHeat exchange: Heat Exchanger

Data Source

PatentUS20250120050A1Container and container data center
Publication Date: 2025.04.10 BEIJING BITMAIN TECHNOLOGIES
  • US20250120050A1 patent drawing
  • US20250120050A1 patent drawing
  • US20250120050A1 patent drawing

AI summary

The present application provides a container and a container data center. The container includes a box, a heat dissipation pipeline, a coil component, a supply component, and an extraction component. The box has an accommodating cavity, and the heat dissipation pipeline, the coil component, the supply component and the extraction component are all located outside the box. The heat dissipation pipeline has an air inlet end and an air outlet end. Two ends of the coil component are respectively connected to the supply component and the extraction component. A cooling medium for cooling high-temperature gas flows inside the coil component and is used to cool the high-temperature gas entering the heat dissipation pipeline from the accommodating cavity. The cooling medium becomes a defective medium after contacting and exchanging heat with the high-temperature gas, and the extraction component is configured to discharge the defective medium.